EL SEGUNDO, Calif. - April 2005 - International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, today introduced two new 30V DirectFET® MOSFET synchronous buck converter chip sets for advanced notebook computer designs using the latest Intel® and AMD processors where small size, high efficiency and improved thermal conduction are required.

"The new 30V chip sets offer high efficiency over their entire rated load range. In addition, these 30V devices offer higher power density than traditional packaging options through the smaller package size and the ability to operate at high current levels using a single control and a single sync MOSFET. This means improved thermal performance and smaller form factors, necessary for super-compact, battery-efficient, portable and mobile computing," said Jeff Sherman, International Rectifier Marketing Manager, Portable Computing Solutions.

Each chip set consists of a control MOSFET and a synchronous MOSFET, with each device tailored to maximize performance in their role within a synchronous DC-DC buck converter circuit. Control MOSFETs have reduced switching losses, while synchronous MOSFETs have low conduction losses (low on-resistance), and low reverse-recovery charge.

The first chip set, the IRF6617 control FET and IRF6611 synchronous FET, is designed for optimum performance up to 20A per power channel in high density, space-restricted circuit boards. The second pair, the IRF6637 control FET and IRF6678 synchronous FET, is designed for increased thermal performance in applications requiring greater than 20A per power channel.

The IRF6617 control FET is housed in a small can (ST) DirectFET package while the IRF6637 control FET housed in the medium can (MP) DirectFET package. To enable an easy migration path for existing designs, both synchronous FETs are housed in the medium can (MX) DirectFET package, allowing a simple change from the IRF6611 to the IRF6678 when more current or increased thermal performance is desired.

The new chip sets also enable circuit designers to shrink high frequency, high current DC-DC converters used to power high-end desktop computers and servers, as well as advanced telecom and datacom systems.

Patented DirectFET® Packaging Technology

International Rectifier's patented DirectFET MOSFET packages present a whole new set of design advantages not previously delivered by standard plastic discrete packages. Their metal can construction enables dual-side cooling that effectively doubles the current handling capacity of high frequency DC-DC buck converters powering advanced microprocessors. In addition, devices in the DirectFET packages are lead- and bromide-free.

Part Number	Function	Package	BVDSS (V)	RDS(on) max @10V(mOhm)	RDS(on) max @4.5V(mOhm)	VGS(V)	ID @ Tc=25ºC (A)	QG typ (nC)	QGD typ (nC)
IRF6678	SynchFET	DirectFET MX	30	2.2	3.0	20	150	43	15
IRF6611	SynchFET	DirectFET MX	30	2.6	3.4	20	150	37	12.5
IRF6637	ControlFET	DirectFET MP	30	7.7	10.8	20	59	11	4.0
IRF6617	ControlFET	DirectFET ST	30	8.1	10.3	20	55	11	4.0

Availability and Pricing

The new 30V DirectFET® MOSFETs are available immediately. Pricing is as follows, in US dollars and 10,000-unit quantities:

IRF6678 synchronous FET: $1.25 each
IRF6611 synchronous FET: $1.09 each
IRF6637 control FET: $0.91 each
IRF6617 control FET: $0.87 each
Prices are subject to change.

Patent and Trademark Notice

IR's proprietary DirectFET technology is covered by US Patents 6624522, 6784540 and multiple other US and foreign pending patent applications. DirectFET® is a trademark of International Rectifier Corporation. IR® and HEXFET® are registered trademarks of International Rectifier Corporation. All other product names noted herein may be trademarks of their respective holders.

For more information related to DirectFET MOSFET Packaging Technology visit the DirectFET Home page.