International Rectifier - DirectFET MOSFETs

DirectFET Discovery

Selector Guide

Thermal Calcualtions

The International Rectifier DirectFET power package is a breakthrough surface-mount power MOSFET packaging technology designed for efficient topside cooling in a SO-8 footprint. In combination with improved bottom-side cooling, the new package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or enhanced SO-8 packages. This effectively doubles current density (A/in²) at a lower total system cost. The DirectFET MOSFET family offerings match 20V and 30V synchronous buck converter MOSFET chipsets, followed by the addition at 30V targeted for high frequency operation. The DirectFET MOSFET family is also available in three different can sizes giving maximum flexibility for all your design needs.

International Rectifier DirectFET® MOSFETs win prestigious 'R&D 100 Award', 'Top 10 DC-DC 2003 Award' and 'Product of the Year Award'.

25V DirectFET® Chipset Optimized for High Frequency, High Efficiency DC-DC Applications

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FEATURES AT A GLANCE

	RoHs compliant containing no lead or bromide
	Not all DirectFET MOSFETs are Qualified for use with lead-free solder; see PbF Qualification pages to determine part status.
	1.4°C/W junction to case thermal resistance (R_th(J-C)) enables highly effective top-side cooling
	Less than 1°C/W R_{th(junction-pcb)} in same footprint as SO-8
	Over 90% lower die-free package resistance (DFPR) than SO-8
	0.7mm profile compared to 1.75mm for SO-8
	Direct chip attach with no wire bonding or lead-frame
	Lower package inductance for higher frequencies
	Compatible with high volume manufacturing equipment and processes

THE IR ADVANTAGE

	Increases current density by a factor of two
	Cuts MOSFET part count by 60%
	Reduces PCB space by 50%
	Up to 50°C lower operating temperature increases reliability
	Lower total system cost

APPLICATIONS

VRM modules for Servers (sync buck)

Workstations and mainframes (sync rectification, ORing)

High-performance notebooks (sync buck)

Advanced telecom and datacom systems (bus converter)

Radio controlled toys (motor control)

Battery operated tools (motor control)

Class D audio

Technical Papers

Understanding the Effect of Power MOSFET Package Parasitics on VRM Circuit Efficiency at Frequencies Above 1MHz PDF

High Current Voltage Regulator Module Emplys Novel Packaging Technology to Achieve Over 100A in a Compact Footprint to Power Next Generation Servers PDF

DirectFET® - A Proprietary New Source Mounted Power Package for Board Mounted Power PDF

Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors PDF

Evaluation of Power MOSFET Thermal Solutions for Desktop and Mobile Processor Power PDF

Application Notes

DirectFET®; Technology: Board Mounting Guidlines PDF

Step-by-Step DirectFET® Rework With Microscreen QuickTime Movie (4.3MB)

DirectFET® Technology Materials and Practices PDF

Discovery Center
Selector Guide
Thermal Calculations

DirectFET MOSFET Overview
Applications
Engineering
FAQs
Design Support

Introduction
High Frequency Operation
Increasing Power Density
Reworking Process
Board Layout
Heatsinking
Mechanical Features
Board Mount Guidelines
Reliability


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