International Rectifier Introduces 30V DirectFET® Synchronous MOSFET for High-Performance Notebook and Server Power Systems

New DirectFET Trench MOSFET Delivers Low On-State Resistance, Low Package Inductance in Reduced Footprint for Vcore Power

EL SEGUNDO, Calif. March 2004 - International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, today introduced the IRF6612, a 30V synchronous MOSFET in IR's proprietary, surface mount DirectFET® package. The IRF6612 delivers the optimum combination of low on-state resistance (4.4mOhms@VGS = 4.5V) and low package inductance to maximize efficiency in notebook and server computers as a synchronous rectifier in non-isolated DC-DC converters. The IRF6612 also can be used in secondary side synchronous rectification for isolated DC-DC converters in networking and communications.

Currently, notebooks using Intel's Centrino™ mobile technology employ a power solution for the processor that is a two-phase design using one control and two synchronous SO-8 packaged MOSFETs per phase. These three SO-8 devices can be replaced by a pair of DirectFET devices per phase when the IRF6612 is used as the synchronous MOSFET and IRF6608 as the control MOSFET. The DirectFET solution reduces part count and the PCB area occupied by the MOSFETs by 33% compared to existing circuit designs using standard discrete devices.

"The IRF6612 combines IR's newest, cutting-edge trench MOSFET technology with its DirectFET packaging technology to maximize power density in space-constrained notebook computers. This is especially important in the fast growing "thin and light" form factor notebooks," said Ralph Monteiro, Marketing Manager for DC-DC Computing Products. "In high-end desktop and server designs where airflow is available, the IRF6612's current carrying capability can be extended up to 30A/phase with a single low-side device," he added.

Patented DirectFET Technology

International Rectifier's DirectFET MOSFET packages present a whole new set of design advantages not previously delivered by standard plastic discrete packages. Their metal can construction solves the serious threat that heat poses to the performance of advanced microprocessors by drawing heat away for the motherboard. By deploying a new dual-side cooling design, the DirectFET power MOSFET family effectively doubles the current handling capacity of high frequency DC-DC buck converters powering these processors and extends their advancement inside high-end desktop PCs, laptops, routers and servers.

IRF6612 and other low voltage MOSFETs can be analyzed and compared in a synchronous buck circuit using the MOSFET selector tool in the myPOWER online design center. The tool is accessible free of charge at http://mypower.irf.com.

Part Number Package BVDSS RDS(on) Max. @10V RDS(on) @4.5V VGS ID@TCASE25°C QG Typ. QGD Typ
IRF6612 DirectFET 30V 3.3mOhm 4.4mOhm 20V 136A 30nC 10nC

For more information related to DirectFET MOSFET Packaging Technology visit the DirectFET Home page.

Pricing and Availability

The IRF6612 is US $1.03 each in 10,000-unit quantities. The new device is available immediately.