International Rectifier - DirectFET Product Information

DirectFET®; MOSFET: Medium Can Substrate Layout

MX Medium Can Outline, Substrate Layout
MX Stencil Design

MX-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MX-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

MT Medium Can Outline, Substrate Layout
MT Stencil Design

MT-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MT-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

MN Medium Can Outline, Substrate Layout
MN Stencil Design

MN-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MN-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

MP Medium Can Outline, Substrate Layout
MP Stencil Design

MP-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MP-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

MQ Medium Can Outline, Substrate Layout
MQ Stencil Design

MQ-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MQ-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

MZ Medium Can Outline, Substrate Layout
MZ Stencil Design

MZ-outline device outline The relative pad positions are controlled to an accuracy of ±0.065mm.	MZ-outline substrate layout Aperture Tolerance = ±0.025mm Positional Tolerance = ±0.075mm
NOTE: Gate and source pads on the substrate are oversized by 0.025mm (0.001”) on each side. Drain pads are thickened by 0.500mm (0.020”).

IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and other US and foreign pending patent applications.

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Introduction
High Frequency Operation
Increasing Power Density
Reworking Process
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Pads and Outlines
     Small Can Outline
     Medium Can Outline
Board Layout Suggestions
     Layout Examples
Markings and Pad Numeration


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