MIL-PRF-19500 Screening and Quality Conformance Inspection Requirements

 

MIL-PRF-19500 covers screening requirements that all parts are submitted to as well as Quality Conformance inspection consisting of one or more of Group A, B, C, D and E for acceptance of the design of the process and of the production lot.

MIL-PRF-19500 applies to discrete components such as MOSFETs and Schottkys. QPL discrete components have been qualified per MIL-PRF-19500.

For more information on MIL-PRF-19500 screening and quality conformance inspection, consult the DoD document or contact factory.

 
MIL-PRF-19500 Screening Requirements
MIL Screen Test/Inspection   MIL-STD-750 Method
JANS
1b Internal visual inspection (precap) 100% 2069
  Apply Silicone Die Coat 100%  
  Lot Accumulation    
3a Temperature cycling 20 cycles. No dwell time. Condition C -55C to 150C 100% 1051 Condition C
4 (1) Constant acceleration not required per DLA approval N/A 2006
5 (1) Particle impact noise detection 5 (1) (devices with internal cay. And no die coat) 100% 2052 Condition A
8 Case Marking and Serialization of devices 100%  
15 Radiography 100% 2076
  Thermal impedance / Delta VSD 100% 3161
  IL Test 100% 3470
  SOA 100%  
  Initial Test / Gate Stress 100%  
9 Pre Burn-in electrical parameters, R&R 100%  
10 High temperature gate bias (HTGB), 48 hrs, MOSFET 100% 1042 Condition B
11 Interim electrical, R&R and delta parameters for PDA 100%  
12 High temperature reverse bias (HTRB), 240 hrs, MOSFET 100% 1042 Condition A
13 Final electrical test, R%R and delta parameters for PDA 100%  
  Outlier Identification 100% Initial + Final
  Hot and cold electrical test, R&R 100%  
  Outlier Identification 100% Hot + Cold
  Case Marking remive this is done at step 8 100%  
14 Hermetic seal (fine and gross leak) 100% 1071
  Bubble Test in FC, no presurization 100%  
17 Case Isolation (Case Isolated Packages) 100% 1081
  Group A2 electrical test 100%  
  Outlier Identification 100%  
16 External visual exam 100% 2071
(1) IR HiRel uses an alternate method and omits constant acceleration and PI ND testing as 100% screen

 

MIL-PRF-19500 Quality Conformance Inspection

MIL-PRF-19500 Group A Inspection Electrical Verification
Sub Group Parameters MIL-STD-750 Test Method JANS Quantity (accept number) JANTX, JANTXV Quantity (accept number)
1 Visual and mechanical inspection 2071 15 (0) 45 (0)
2 DC (static) test at +25°C +/-3C   116 (0) 116 (0)
3 DC (static) tests at max. and min. temps at high (- OC, +10C) and low (+OC, -10C) specified temperatures.  
4 Dynamic tests at +25°C, +/-3C  
5 Safe operating area test (power trans.):
a. DC
b. Clamped inductive
c. Undamped inductive
End point electrical measurements
  45 (0) 45 (0)
6 Surge current (diodes and rectifiers) End point electrical measurements   22 (0)
7 Selected static and dynamic tests  

 

MIL-PRF-19500 Group B Inspection
Mechanical Verification (JANS)
Sub Group Parameters MIL-STD-750 Method JANS, Large Lot Quantity (accept number) JANS, Small Lot Qua ntity (accept number)
1 Physical dimensions (case outline) 2066 22 (0) 8 (0)
2 Solderability 2026 15 leads (0) 6 leads (0)
Resistance to solvents (ink mark only) 1022 15 (0) 6 (0)
Salt Atmosphere (laser marked metal) 1041 3(0) 3 (0)
3 Temperature cycling (100 cycles) 1051 22 (0) 6 (0) 12(0) die coat device
Surge (diodes only) 4066
Hermetic seal (fine and gross leak) 1071
Constant acceleration 20kG or 10kG > 10W (Die Coat devices only) 2006
Particle impact noise detection, cond A (Die Coat devices only) 2052
Electrical measurements, A2  
Decap internal visual (qualified design) precap 6 (0) 6 (0)
Bond strength, condition D 2037 22 wires (0) or 11 (0) 12 wires (0) or 6 (0)
SEM (when applicable)* 2077 6 (0)  
Die shear 2017 11 (0) 6 (0)
4 Intermittent operating life (6k cycles if wire is 8 mils or greater in diameter, otherwise 2k) 1037 or 1042 22 (0) 12 (0)
Hermetic seal (fine and gross leak) 1071
Electrical measurements, A2  
Thermal impedance (max. 15% shift)  
5 Accelerated Steady State HTGB, power MOSFET 1042 22 (0) 12 (0)
Cond. B, 48 hours @150C, 100% bias  
Electrical measurements, A2  
Accelerated Steady State HTRB, power MOSFET 1042
Cond. A, 240 hours @150C, 100% bias  
Electrical measurements, A2  
Accelerated Steady State for Schottky 1038    
340 hrs@ max rated Tj / 1K hrs per wafer lot      
Electrical measurements, A2      
Bond strength 2037 20 wires (0) 20 wires (0)
6 Thermal resistance (Diodes) 3101, 4081 22 (0) 8 (0)
7 High Temp Life (340 Hours Non-Operating) (Diodes) 1032 32 (0) 12 (0)
Electrical measurements, A2  
*Note: Not applicable for Schottky's

 

MIL-PRF-19500 Group C Inspection Long-term Reliability Verification, Periodic, Each Package Type
Sub Group Parameters MIL-STD-750 Method All Quality Levels Large Lot Quantity (accept number) All Quality Levels Small Lot Quantity (accept number)
1 Physical dimensions (Performed in B1 for JANS) 2066 15 (0) 6 (0)
2 Thermal shock, 25 cycles, cond. B 1056 22 (0) 6 (0)
Terminal strength 2036
Hermetic seal (fine and gross leak) 1071
Moisture resistance 1021
Electrical measurements, A2
3 Shock, 1,500G, 0.5ms, 5 blows, Xl, Y1 and Z1 2016 22 (0) 6 (0) 12 (0) for die coat devices
Vibration, variable frequency 2056
Constant acceleration, 1 minute in each orientation at 20,000 G's minimum, except at 10,000 G's minimum for devices with power rating of 10 watts. 2006
Particle impact noise detection, cond A (die coat devices only) 2052
Electrical measurements, A2  
4 Salt atmosphere (corrosion) 1041 15 (0) 6 (0)
5 Thermal resistance (if not performed in B) 3101, 4081 15 (0) 6 (0)
6 Steady state operation life (1,000 hours min.) or intermittent operating life (6k cycles min.) 1026 22 (0) 12 (0)
1037 or 1042
Electrical measurements, A2  
7 Internal water vapor 1018 5 (0) 5 (0)

 

MIL-PRF-19500 Group D Inspection Radiation Hardness Assurance Program
Sub Group Parameters MIL-STD-750 Method JANTXV Inspection Inspection Lot Lot Quantity Quantity (accept number) JANS Wafer Inspection Inspection Lot Lot Quantity Quantity (accept number)
2 Steady-state total dose irradiation Qualification and conformance inspection End-point electrical parameters 1019   4(0)
2(0)
1(0)
1. For device types 4,000 die per wafer
2. For device types > 500 and < 4,000 die per wafer
3. For device types 500 die per wafer

 

 

MIL-PRF-19500 Group E Inspection Product Qualification
Sub Group Parameters MIL-STD- 750 Method All Quality Levels Quantity (accept number)
1 Thermal shock (100 cycles) or Temp. cycling (500 cycles min.) @ max. storage 1056 45(0)
1051
Hermetic seal (fine and gross leak) 1071
Electrical Measurements, A2  
2 Steady state operation life, HTGB Electrical measurements, A2 1042 45 (0)
 
Steady state operation life, HTRB Electrical measurements, A2 1038, 1042 45 (0)
 
4 Thermal resistance (characterization) 3101, 4081 22 (0)
5 Barometric pressure (devices with rated voltage > 200V 1001 3(0)
6 ESD 1020 11 devices
7 Resistance to Soldering Heat 2031, H.6  
Visual inspection    
Hermetic seal (fine and gross leak) 1071  
Electrical measurements, A2    
8 Single Event Effects (SEE) for ion specie and ion energy. Curve as a function of LET for fixed VGS and VDS bias conditions; 1080