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MIL-PRF-19500 covers screening requirements that all parts are submitted to as well as Quality Conformance inspection consisting of one or more of Group A, B, C, D and E for acceptance of the design of the process and of the production lot.
MIL-PRF-19500 applies to discrete components such as MOSFETs and Schottkys. QPL discrete components have been qualified per MIL-PRF-19500.
For more information on MIL-PRF-19500 screening and quality conformance inspection, consult the DoD document or contact factory.
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MIL-PRF-19500 Screening Requirements |
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MIL Screen |
Test/Inspection |
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MIL-STD-750 Method |
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JANS |
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1b |
Internal visual inspection (precap) |
100% |
2069 |
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Apply Silicone Die Coat |
100% |
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Lot Accumulation |
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3a |
Temperature cycling 20 cycles. No dwell time. Condition C -55C to 150C |
100% |
1051 Condition C |
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4 (1) |
Constant acceleration not required per DLA approval |
N/A |
2006 |
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5 (1) |
Particle impact noise detection 5 (1) (devices with internal cay. And no die coat) |
100% |
2052 Condition A |
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8 |
Case Marking and Serialization of devices |
100% |
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15 |
Radiography |
100% |
2076 |
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Thermal impedance / Delta VSD |
100% |
3161 |
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IL Test |
100% |
3470 |
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SOA |
100% |
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Initial Test / Gate Stress |
100% |
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9 |
Pre Burn-in electrical parameters, R&R |
100% |
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10 |
High temperature gate bias (HTGB), 48 hrs, MOSFET |
100% |
1042 Condition B |
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11 |
Interim electrical, R&R and delta parameters for PDA |
100% |
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12 |
High temperature reverse bias (HTRB), 240 hrs, MOSFET |
100% |
1042 Condition A |
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13 |
Final electrical test, R%R and delta parameters for PDA |
100% |
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Outlier Identification |
100% |
Initial + Final |
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Hot and cold electrical test, R&R |
100% |
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Outlier Identification |
100% |
Hot + Cold |
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Case Marking remive this is done at step 8 |
100% |
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14 |
Hermetic seal (fine and gross leak) |
100% |
1071 |
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Bubble Test in FC, no presurization |
100% |
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17 |
Case Isolation (Case Isolated Packages) |
100% |
1081 |
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Group A2 electrical test |
100% |
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Outlier Identification |
100% |
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16 |
External visual exam |
100% |
2071 |
(1) IR HiRel uses an alternate method and omits constant acceleration and PI ND testing as 100% screen
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MIL-PRF-19500 Quality Conformance Inspection
MIL-PRF-19500 Group A Inspection Electrical Verification |
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Sub Group |
Parameters |
MIL-STD-750 Test Method |
JANS Quantity (accept number) |
JANTX, JANTXV Quantity (accept number) |
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1 |
Visual and mechanical inspection |
2071 |
15 (0) |
45 (0) |
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2 |
DC (static) test at +25°C +/-3C |
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116 (0) |
116 (0) |
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3 |
DC (static) tests at max. and min. temps at high (- OC, +10C) and low (+OC, -10C) specified temperatures. |
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4 |
Dynamic tests at +25°C, +/-3C |
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5 |
Safe operating area test (power trans.):
a. DC
b. Clamped inductive
c. Undamped inductive
End point electrical measurements |
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45 (0) |
45 (0) |
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6 |
Surge current (diodes and rectifiers) End point electrical measurements |
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22 (0) |
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7 |
Selected static and dynamic tests |
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MIL-PRF-19500 Group B Inspection
Mechanical Verification (JANS) |
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Sub Group |
Parameters |
MIL-STD-750 Method |
JANS, Large Lot Quantity (accept number) |
JANS, Small Lot Qua ntity (accept number) |
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1 |
Physical dimensions (case outline) |
2066 |
22 (0) |
8 (0) |
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2 |
Solderability |
2026 |
15 leads (0) |
6 leads (0) |
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Resistance to solvents (ink mark only) |
1022 |
15 (0) |
6 (0) |
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Salt Atmosphere (laser marked metal) |
1041 |
3(0) |
3 (0) |
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3 |
Temperature cycling (100 cycles) |
1051 |
22 (0) |
6 (0) 12(0) die coat device |
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Surge (diodes only) |
4066 |
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Hermetic seal (fine and gross leak) |
1071 |
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Constant acceleration 20kG or 10kG > 10W (Die Coat devices only) |
2006 |
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Particle impact noise detection, cond A (Die Coat devices only) |
2052 |
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Electrical measurements, A2 |
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Decap internal visual (qualified design) |
precap |
6 (0) |
6 (0) |
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Bond strength, condition D |
2037 |
22 wires (0) or 11 (0) |
12 wires (0) or 6 (0) |
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SEM (when applicable)* |
2077 |
6 (0) |
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Die shear |
2017 |
11 (0) |
6 (0) |
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4 |
Intermittent operating life (6k cycles if wire is 8 mils or greater in diameter, otherwise 2k) |
1037 or 1042 |
22 (0) |
12 (0) |
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Hermetic seal (fine and gross leak) |
1071 |
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Electrical measurements, A2 |
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Thermal impedance (max. 15% shift) |
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5 |
Accelerated Steady State HTGB, power MOSFET |
1042 |
22 (0) |
12 (0) |
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Cond. B, 48 hours @150C, 100% bias |
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Electrical measurements, A2 |
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Accelerated Steady State HTRB, power MOSFET |
1042 |
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Cond. A, 240 hours @150C, 100% bias |
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Electrical measurements, A2 |
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Accelerated Steady State for Schottky |
1038 |
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340 hrs@ max rated Tj / 1K hrs per wafer lot |
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Electrical measurements, A2 |
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Bond strength |
2037 |
20 wires (0) |
20 wires (0) |
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6 |
Thermal resistance (Diodes) |
3101, 4081 |
22 (0) |
8 (0) |
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7 |
High Temp Life (340 Hours Non-Operating) (Diodes) |
1032 |
32 (0) |
12 (0) |
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Electrical measurements, A2 |
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*Note: Not applicable for Schottky's |
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MIL-PRF-19500 Group C Inspection Long-term Reliability Verification, Periodic, Each Package Type |
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Sub Group |
Parameters |
MIL-STD-750 Method |
All Quality Levels Large Lot Quantity (accept number) |
All Quality Levels Small Lot Quantity (accept number) |
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1 |
Physical dimensions (Performed in B1 for JANS) |
2066 |
15 (0) |
6 (0) |
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2 |
Thermal shock, 25 cycles, cond. B |
1056 |
22 (0) |
6 (0) |
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Terminal strength |
2036 |
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Hermetic seal (fine and gross leak) |
1071 |
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Moisture resistance |
1021 |
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Electrical measurements, A2 |
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3 |
Shock, 1,500G, 0.5ms, 5 blows, Xl, Y1 and Z1 |
2016 |
22 (0) |
6 (0) 12 (0) for die coat devices |
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Vibration, variable frequency |
2056 |
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Constant acceleration, 1 minute in each orientation at 20,000 G's minimum, except at 10,000 G's minimum for devices with power rating of 10 watts. |
2006 |
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Particle impact noise detection, cond A (die coat devices only) |
2052 |
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Electrical measurements, A2 |
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4 |
Salt atmosphere (corrosion) |
1041 |
15 (0) |
6 (0) |
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5 |
Thermal resistance (if not performed in B) |
3101, 4081 |
15 (0) |
6 (0) |
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6 |
Steady state operation life (1,000 hours min.) or intermittent operating life (6k cycles min.) |
1026 |
22 (0) |
12 (0) |
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1037 or 1042 |
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Electrical measurements, A2 |
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7 |
Internal water vapor |
1018 |
5 (0) |
5 (0) |
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MIL-PRF-19500 Group D Inspection Radiation Hardness Assurance Program |
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Sub Group |
Parameters |
MIL-STD-750 Method |
JANTXV Inspection Inspection Lot Lot Quantity Quantity (accept number) |
JANS Wafer Inspection Inspection Lot Lot Quantity Quantity (accept number) |
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2 |
Steady-state total dose irradiation Qualification and conformance inspection End-point electrical parameters |
1019 |
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4(0)
2(0)
1(0) |
1. For device types 4,000 die per wafer
2. For device types > 500 and < 4,000 die per wafer
3. For device types 500 die per wafer |
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MIL-PRF-19500 Group E Inspection Product Qualification |
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Sub Group |
Parameters |
MIL-STD- 750 |
Method All Quality Levels Quantity (accept number) |
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1 |
Thermal shock (100 cycles) or Temp. cycling (500 cycles min.) @ max. storage |
1056 |
45(0) |
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1051 |
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Hermetic seal (fine and gross leak) |
1071 |
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Electrical Measurements, A2 |
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2 |
Steady state operation life, HTGB Electrical measurements, A2 |
1042 |
45 (0) |
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Steady state operation life, HTRB Electrical measurements, A2 |
1038, 1042 |
45 (0) |
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4 |
Thermal resistance (characterization) |
3101, 4081 |
22 (0) |
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5 |
Barometric pressure (devices with rated voltage > 200V |
1001 |
3(0) |
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6 |
ESD |
1020 |
11 devices |
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7 |
Resistance to Soldering Heat |
2031, H.6 |
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Visual inspection |
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Hermetic seal (fine and gross leak) |
1071 |
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Electrical measurements, A2 |
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8 |
Single Event Effects (SEE) for ion specie and ion energy. Curve as a function of LET for fixed VGS and VDS bias conditions; |
1080 |
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