ESCC 5010
Infineon's ESA-qualified rad hard RF bipolar transistors and diodes are tested to verify their high reliability with an assurance program based on the requirements outlined in ESCC-5010. Radiation hardness assurance is guaranteed by testing every manufacturing wafer-diffusion lot for total dose steady-state irradiation according to the ESCC Basic Specification No. 22900.
| ESCC Chart | ESCC Para. | Test/Inspection | Flight parts (ES) | Method |
| F2 - Production Control |
|
WAFER LOT ACCEPTANCE |
|
|
| 5.2.1 |
Process Monitoring Review |
100% |
|
|
| 5.2.2(a) |
Room Temperature Electrical Measurements |
100% |
|
|
| 5.2.2(b) |
High and Low Temperature Electrical Measurements |
sample |
|
|
| Wafer dicing |
|
|||
| 5.2.2(c) |
Die Visual Inspection |
100% |
ESCC Basic Specification 20400 |
|
| 5.2.3 |
Die Dimensions (Note 1) |
|
||
| 5.2.4 |
SEM Inspection |
sample |
ESCC Basic Specification 21400 |
|
| 5.2.5 |
Total Dose Radiation Testing |
sample |
ESCC Basic Specification 22900 |
|
| SPECIAL IN-PROCESS CONTROLS |
|
|||
| Assembly |
|
|||
| 5.3.2 |
Internal Visual Inspection (precap) |
100% |
ESCC Basic Specification 20400 |
|
| 5.3.3 |
Bond Strength |
sample |
MIL-STD-750, Test Method 2037, Condition C or D |
|
| 5.3.3 |
Die Shear |
sample |
MIL-STD-750, Test Method 2017 |
|
| Encapsulation |
|
|||
| 5.3.4 |
Dimension Check |
sample |
ESCC Basic Specification 20500 |
|
| 5.3.5 |
Weight (Note 1) |
|
|
Note 1 – guaranteed but not tested
| ESCC Chart | ESCC Para. | Test/Inspection | Flight parts (ES) | Method |
| F3 – Screening Tests |
8.7 |
High Temperature Stabilisation Bake |
100% |
MIL-STD-750, Test Method 1032 |
| 8.8.1 |
Temperature Cycling (Note 1) |
100% |
MIL-STD-202, Test Method 107, Condition B, 20 cycles |
|
| 8.9 |
Particle Impact Noise Detection (PIND) |
100% |
MIL-STD-750, Test Method 2052, Condition A |
|
| 8.1.1.2 |
Room Temperature Electrical Measurements |
100% |
|
|
| 6.1 |
Serialisation |
100% |
|
|
| 8.1.3 |
Parameter Drift Values (Initial Measurements) |
100% |
|
|
| 8.10 |
Burn-in 1 |
100% |
acc. ESCC Detail Specification, 48h |
|
| 8.1.3 |
Parameter Drift Values (Final Measurements for Burn-in 1; |
100% |
|
|
| 6.4.1 |
Check for Lot Failure for Burn-in 1 (PDA1 = 5%) |
|
||
| 8.11 |
Burn-in 2 |
100% |
acc. ESCC Detail Specification, 240h |
|
| 8.1.3 |
Parameter Drift Values (Final Measurements) |
100% |
|
|
| 6.4.1 |
Check for Lot Failure for Burn-in 2 (PDA2 = 5%) |
100% |
|
|
| 8.1.2.2 |
High and Low Temperatures Electrical Measurements |
sample |
|
|
| 8.1.1.2 |
Room Temperature Electrical Measurements |
100% |
|
|
| 6.4.1 |
Check for Lot Failure for Screening Tests (PDA3 = 10%) |
100% |
|
|
| 8.12 |
Radiographic Inspection (Note 1) |
100% |
ESCC Basic Specification 20900, performed in the X and Z axes only |
|
| 8.13 |
Seal (Fine Leak) (Note 1) |
100% |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.13 |
Seal (Gross Leak) |
100% |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.6 |
External Visual Inspection |
100% |
ESCC Basic Specification 20500 |
Note 1 – deviation from ESCC 5010 agreed with the ESCC Executive. See. ESCC Detail Specification
Note 2 – not applicable unless otherwise stipulated in the Purchase Order
| ESCC Chart | ESCC Para. | Test/Inspection | Min. quanitity | Method |
| F4 – Qualification, Periodic Testing and Lot Validation Testing for Packaged Components |
|
ENVIRONMENTAL/MECHANICAL SUBGROUP (24 Months Period) |
||
| 8.8.2 |
Temperature Cycling (Note 1) |
6 |
MIL-STD-202, Test Method 107, Condition B, 100 cycles |
|
| 8.14 |
Mechanical Shock (Note 1) |
N.A. |
MIL-STD-750, Test Method 2016, 1500g, 0.5ms duration, 5 shocks, planes X1, Y1 and Z1 |
|
| 8.15 |
Vibration (Note 1) |
N.A. |
MIL-STD-750, Test Method 2056, 20g, 10-2000Hz, cross over at 50Hz |
|
| 8.16 |
Constant Acceleration (Note 1) |
N.A. |
MIL-STD-750, Test Method 2006, 20000g, planes X1, Y1 and Y2 |
|
| 8.17 |
Moisture Resistance |
6 |
MIL-STD-750, Test Method 1021 |
|
| 8.13 |
Seal (Fine Leak) (Note 1) |
6 |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.13 |
Seal (Gross Leak) |
6 |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.1.4 |
Intermediate and End-Point Electrical Measurements |
6 |
|
|
| 8.6 |
External Visual Inspection |
6 |
ESCC Basic Specification 20500 |
|
| ENDURANCE SUBGROUP (24 Months Period) |
||||
| 8.18 |
Operating Life 1000 Hours |
8 |
acc. ESCC Detail Specification |
|
| 8.1.4 |
Intermediate and End-Point Electrical Measurements |
8 |
|
|
| 8.13 |
Seal (Fine Leak) (Note 1) |
8 |
MIL-STD-883, Test Method 1014, Condition A1 or A2 |
|
| 8.13 |
Seal (Gross Leak) |
8 |
MIL-STD-750, Test Method 1071, Condition C |
|
| 8.6 |
External Visual Inspection |
8 |
ESCC Basic Specification 20500 |
|
|
|
ASSEMBLY CAPABILITY SUBGROUP (24 Months Period) |
|||
| 8.19 |
Solderability |
2 |
MIL-STD-750, Test Method 2026 |
|
| 8.20 |
Permanence of Marking (Note 2) |
N.A. |
ESCC Basic Specification 24800 |
|
| 8.21 |
Terminal Strength |
2 |
MIL-STD-750, Test Method 2036 |
|
|
|
DE-ENCAPSULATION SUBGROUP (24 Months Period) |
|||
| 8.2 |
Internal Visual Inspection |
6 |
ESCC Basic Specification 20400 |
|
| 8.5.1 |
Bond Strength |
6 |
MIL-STD-750, Test Method 2037, Condition C or D. |
|
| 8.5.2 |
Die Shear |
6 |
MIL-STD-750, Test Method 2017 |
|
Note 1 – deviation from ESCC 5010 agreed with the ESCC Executive. See. ESCC Detail Specification
Note 2 – not applicable due to laser marking
