HybridPACK™ Drive
HybridPACK™ Drive with Si and SiC technology is Infineon’s market leading power module for traction inverters of electric vehicles
The HybridPACK™ Drive is a highly compact B6-bridge power module optimized for hybrid and electric vehicles traction applications. Its design allows customers to scale performance levels, with thermal stacks, between Si and SiC technologies and different chipsets, according to their desired cost-performance trade-off while maintaining the same module footprint.
The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit.
In 2023, Infineon launched the second generation of the power module: the HybridPACK Drive G2 with Infineon’s the next generation chip technologies EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET. The HybridPACK™ Drive G2 power module provides high ease-of-use and new features, such as an integration option for next-generation phase current sensor and on-chip temperature sensing, to enable system cost improvements. It allows for performances up to 300 kW within the 750 V and 1200 V classes. A higher temperature rating is enabled by use new materials (new black plastic housing).
With a track record of almost 8.5 million units sold since 2017, the HybridPACK™ Drive is Infineon’s market-leading power module family for electric vehicles.
- Most scalable power portfolio in the market with IGBT and CoolSiC™ options in 1200/750V for various power classes , without need for major system redesign
- HybridPACK™ Drive G1: EDT2 and CoolSiC™ chipset with high power density and soft switching behavior for ease of design for traction inverters in EVs
- HybridPACK™ Drive G2 continuing the success: EDT3 and CoolSiC™ G2 technology with new benchmark performance and efficiency for improved cost/performance ratio
- Full automotive qualification AQG324
This complete system solution based on HybridPACK™ Drive accelerates design-in for traction inverters up to 300 kW. It demonstrates the market’s most scalable power solutions with HybridPACK™ Drive CoolSiC™ G2, EiceDRIVER™ isolated gate drivers, coreless current and rotor position sensors, and AURIX™ MCUs.
- Get to know Infineon’s IPOSIM tool, specifically for an automotive electric vehicle inverter
- Discover the steps involved in simulating different parameters and comparing the results of different Infineon products to see which is the best fit for your application
- Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
- Learn where and how this high-quality standard is reflected and discover our success stories
HybridPACK™ Drive addresses the 3 main challenges that main inverter solutions currently face:
- Performance increase
- Scalable performance
- And ease-of-design, aimed at reducing customer’s time to market and system cost.
- Infineon's HybridPACK™ Drive silicon carbide compact power modules cater to the increasing demand for high range, efficiency, and power in electrified vehicles, enabling longer drive range, compact size, and optimized system cost.
- The second generation of Infineon's HybridPACK™ Drive, utilizing CoolSiC™ technology, offers a scalable product family with enhanced features and package improvements, providing added value to customers.