EL SEGUNDO, Calif.--(BUSINESS WIRE) -- International Rectifier Corporation (NYSE:IRF) today announced it is participating in two key industry events in Asia.

IR will present at the EDN Korea Power Management/ System Design Methodology Conference in Seoul, Korea and the EDN China Innovation Conference, Shenzhen, China.

David Poon, IR’s vice president, Asia Sales said: “As a leader in power management, we are delighted to share our expertise with the Asia engineering community at these key events and support the quest for power efficient designs by providing innovative solutions”.

IR will participate in the following conferences:

EDN Korea Power Management/ System Design Methodology Conference - Seoul

Xavier de Frutos, IR’s Director, Technical Marketing & Applications Center, Europe, will present “Enabling Technologies for Now and the Future of Automotive” at EDN Asia's Power Management/System Design Methodology (PM/SDM) Conference which takes place in Seoul on October 30, 2008. The presentation focuses on IR’s automotive grade power management solutions that meet the needs of 12V, 24V and hybrid electric (HE) and electric vehicle (EV) applications. More information is available at

EDN China Innovation Conference - Shenzhen

Graham Robertson, global vice president, Marketing and Corporate Communications at IR will present “Is Energy-efficiency Alone Enough? Power Technologies Enable An Energy-efficient World” at the EDN China Innovation Conference on November 6, 2008 in Shenzhen. This presentation will focus on energy efficient power management technologies and solutions that can potentially save up to 30 percent of the world’s energy. More information is available at

In addition, IR will be presented with a “Leading Product” award at the EDN China Innovation Awards held as part of the conference for the company’s SupIRBuck™ portfolio of versatile wide input, single output integrated point-of-load (POL) DC-DC voltage regulators.

SupIRBuck integrates IR’s co-designed high performance synchronous buck control ICs with benchmark HEXFET® trench technology in a compact 5mm by 6mm Power QFN package, shrinking the silicon footprint by 70 percent compared to discrete solutions, and offering up to 10 percent higher full-load efficiency than competing monolithic ICs. The SupIRBuck IR38xx family of nine devices provides a highly efficient power solution for data center applications including enterprise servers while the SupIRBuck IR380x family of six devices for consumer embedded POL applications up to 14 amps are optimized for high performance consumer applications including game consoles, desktop PCs, graphics cards, set-top boxes and LCD TVs. For more information on SupIRbuck visit www.irf.com