INTERNATIONAL RECTIFIER - THE POWER MANAGEMENT LEADER

IR’s SupIRBuck® Family of Integrated Voltage Regulators Named as a Finalist in EDN China Innovation Awards 2008

EL SEGUNDO, Calif.— International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, today announced the SupIRBuck® family of integrated voltage regulators for data center and consumer applications has been selected as a finalist in the EDN China Innovation Award’s Power Device and Module category.

SupIRBuck integrates IR’s high performance control ICs optimized with benchmark HEXFET® MOSFETs in a compact 5mm x 6mm power QFN package to enable up to 70 percent space savings compared to discrete solutions. The SupIRBuck IR381x and IR382x family of nine devices for data center applications including enterprise servers provides a highly efficient power solution offering between eight to 10 percent higher full-load efficiency than competing monolithic ICs, while the SupIRBuck IR380x family of six devices for consumer embedded POL applications up to 14 amps are optimized for high performance, cost-sensitive consumer applications including game consoles, desktop PCs, graphics cards, set-top boxes and LCD TVs.

“We are delighted that the editors of EDN China have selected SupIRBuck as a finalist in this year’s awards. Because of its high level of integration and unique, scalable common footprint, designers can simplify their design to significantly reduce risk and enable faster time-to-market while achieving significant space and energy savings,” said Goran Stojcic, executive director, IR Enterprise Power Applications and Technical Marketing.

The SupIRBuck family of integrated voltage regulators is designed for 4, 7 and 12 amps of output load current at 600kHz and 6, 9 and 14 amps at 300kHz respectively. Key features include wide range input of 2.5 V to 21 V and output range of 0.6 V to 12 V, pre-bias start up, a choice of two fixed switching frequencies, hiccup current limit, thermal shutdown and precise output voltage regulation. SupIRBuck’s thermally enhanced packages with slim 0.9mm profile allow mounting on the back-side of the motherboard for additional space saving in high density applications.

A panel of industrial experts and EDN China's technical editors selected the finalists in this year’s Innovation Award competition. Readers will select the winners through an online ballot available at EDN China’s website at http://award.ednchina.com/ from July 11 to September 10, 2008. Finalists will be honored and winners announced at EDN China's award presentation ceremony on November 6 in Shenzhen, China.

EDN, the premier electronics design magazine, is part of Reed Electronics Group, the electronics industry’s largest global information provider. For more information, go to www.edn.com.

 
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