EL SEGUNDO, Calif.— International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, today announced that the company has finalized agreements with two semiconductor suppliers, headquartered in different regions of the world, to license International Rectifier’s DirectFET® packaging technology.

Based on a groundbreaking double-sided cooling technique, the DirectFET MOSFET packaging technology was introduced in 2002 and quickly became a preferred solution to address mounting thermal limitations found in advanced computing, consumer and communications applications. Since its introduction, the DirectFET has become the fastest growing product in the company’s history. Because of the DirectFET package’s ability to improve current density and performance, the company expects the packaging technology will become the industry standard across a wide range of applications as a result of the licensing agreements.

International Rectifier’s CEO Alex Lidow said, “We’re continually developing technology to save energy. IR’s DirectFET package technology helps advance the course of computing by reducing energy losses while shrinking the design footprint.” He added, “Through these licensing agreements, we can broaden the energy-saving impact made possible with IR’s DirectFET packaging innovation.”