International Rectifier Introduces 0.5A and 1.0A CSP Schottky Diodes that Shrink Footprints by 70%-Plus for Portable Applications

EL SEGUNDO, Calif. — September 2005 — International Rectifier, IR® (NYSE: IRF), a world leader in power management technology, today introduced four new FlipKY™ Schottky diodes that are smaller and more efficient than typical industry-standard Schottky devices. Offered in space-saving chip-scale packages (CSP), these new 0.5A and 1.0A devices are ideal for handheld, portable equipment where space is crucial such as cell phones, smart phones, MP3 players, PDAs and miniature hard disk drives. Applications include current steering, ORing, boost and freewheeling circuits.

The 30-volt IR0530CSP and 40-volt IR05H40CSP are 0.5A devices housed in a compact three-bump, CSP that occupies only 1.1mm2 of board space with a profile of less than 0.6mm. Compared to industry-standard SOD-123-packaged Schottky diodes, IR’s new 0.5A FlipKY devices occupy 80% less board space and operate up to 40% cooler.

The 30-volt IR130CSP and 40-volt IR1H40CSP are 1A BGA devices, occupying only 2.3mm2 of board space, or about one third of the area consumed by a JEDEC DO-216AA package, yet deliver similar electrical and thermal performance.

“As handheld, portable devices continue to shrink while their functionality grows, the need for smaller power management components increases. IR’s FlipKY product family delivers devices that are smaller and thinner, helping designers meet the demand of their product development roadmaps,” said John Lambert, Product Marketing Engineer.

FlipKY™ Packaging Technology Highlights

IR’s FlipKY chip-scale packaging technology eliminates the lead frame, epoxy and mold compound traditionally used in other device packages and provides all electrical connections on one side of the silicon. This design not only minimizes board space and device profile, but also reduces parasitic inductance. In high frequency switching applications, such as boost converters for LCD displays or LED drives, less parasitic inductance reduces voltage spikes and switching noise, which improves electrical efficiency and reduces EMI. The large bumps of the new 0.5A devices like the IR05H40CSP also serve as very efficient heat conduction paths to the PCB, enabling cooler operation than traditional leadframe devices. In addition, the packaging technology enables the parts to be assembled with standard SMT techniques.

Part Number IF(AV)
VF max @125°C
IR max @25°C
TJ Range
IR0530CSP 0.5 30 0.33 50 -55 to 150
IR05H40CSP 0.5 40 0.42 10 -55 to 150
IR130CSP 1.0 30 0.33 100 -55 to 150
IR1H40CSP 1.0 40 0.42 10 -55 to 150
Design Assistance

Data sheets are posted on the International Rectifier Web site, In addition, Application Note AN-1079, “Board Mounting 0.5A FlipKY™” and Application Note AN-1011, “Wafer Level Package Technology,” describe proper assembly techniques and suggestions for the 0.5A and 1A devices.

Availability and Pricing

The new FlipKY devices are available now. Pricing for the IR0530CSP and IR05H40CSP is US $0.17 each in 10,000-unit quantities. The IR130CSP and IR1H40CSP are US $0.25 each in 10,000-unit quantities. The TR suffix indicates Tape and Reel (for example, IR0530CSPTR). Lead-free versions are available, designated by the suffix PbF (for example, IR0530CSPTRPbF). Prices are subject to change.