INTEL DEVELOPER FORUM, San Francisco, March 1, 2005 - International Rectifier, IR® (NYSE: IRF), a global leader in power management technology, is highlighting its latest power management innovations for high performance computing at the Intel Developer Form (IDF) taking place in San Francisco's Moscone Center March 1-3, 2005.

"IDF is an ideal forum for International Rectifier to display its industry-leading architectures and proprietary power management solutions. As the only company to focus exclusively on power management, our designers are orchestrating an expansive portfolio of technologies including silicon, power systems and packaging to effectively address technology roadblocks. One critical challenge where our products are enjoying tremendous success is in solving the thermal limitations facing today's motherboard designers," said Gene Sheridan, vice president of IR's Computer and Communications group.

Products to be showcased include:

XPhase™ Control Chip Set and Distributed Power Architecture

IR's XPhase chip set is a scalable, distributed power architecture for today's advanced microprocessors. Developed specifically for multiphase interleaved buck DC-DC converters, IR's XPhase chip set consists of the IR3081A Control IC and the IR3086A Phase IC. The chip set provides a high performance solution that exceeds VRM or EVRD 10.x requirements. Unlike other multiphase solutions that are limited in the number of phases they drive, IR's XPhase architecture can support from one to "X" phases, which can be added or removed without changing the fundamental design.

DirectFET® Packaged MOSFETs

International Rectifier's patented DirectFET power package is a breakthrough surface-mount power MOSFET packaging technology designed for efficient topside cooling in either an SO-8 or Micro-8 footprint. In combination with improved bottom-side cooling, the package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or enhanced SO-8 packages. This effectively doubles current density (A/in2) at a lower total system cost.

The DirectFET MOSFET family includes matched 20V and 30V synchronous buck converter MOSFET chip sets, as well as 40V and 100V devices targeted at primary side control and synchronous rectification in 24V and 48V input power supplies.

iPOWIR™ Integrated Power System Building Blocks

iPOWIR multi-chip modules are intelligent, scalable power system building blocks that provides high current density for multiphase converters as well as dual and single output synchronous buck converters. IR's expertise in device matching and "short trace" layout delivers these optimized solutions that combine multiple power semiconductors, ICs, and passive components into single BGA or LGA packages.

About International Rectifier

International Rectifier (NYSE:IRF) is a world leader in power management technology. IR's analog and mixed signal ICs, advanced circuit devices, integrated power systems and components enable high performance computing and reduce energy waste from motors, the world's single largest consumer of electricity. Leading manufacturers of computers, energy efficient appliances, lighting, automobiles, satellites, aircraft and defense systems rely on IR's power management benchmarks to power their next generation products.

Trademark Notice

DirectFET®, iPOWIR™, IR® and XPhase™ are trademarks or registered trademarks of International Rectifier Corporation. IR's proprietary DirectFET technology is covered by US Patent 6,624,522 and other US and foreign pending patent applications.

All other product names noted herein may be trademarks of their respective holders.

For more information, contact Graham Robertson, grobert1@irf.com, 310-726-8512.