EL SEGUNDO, Calif. August 2003 - International Rectifier, IR® (NYSE: IRF), today introduces the smallest Schottky diode in the industry. The IR140CSP FlipKY™ device utilizes standard ball-grid array (BGA) technology, and occupies a total area of 2.25mm2, or 86% smaller than the standard SMA package, and as much as 32% smaller than similar competing lead-less devices. The 1A, 40V Schottky diode is a four-ball, 1.5mm x 1.5mm device with a profile of less than 0.8mm. The FlipKY revolutionizes the low power Schottky diode market by eliminating the lead frame and epoxy traditionally used in other devices.

The FlipKY is ideal for hand-held, portable equipment such as cell phones, PDAs, notebook computers, hand held computers, MP3 players and hard disk drives where the small size is crucial to equipment success.

BGA technology enables size reduction and better heat transfer away from the die junction to the circuit board. Moreover, since this device is made with true chip scale packaging, it dissipates heat directly from the die into the air, increasing thermal efficiency. In fact, thermal resistance junction-to-ambient is rated at 75°C/W maximum and thermal resistance junction-to-PCB is typically 55°C/W.

Since the IR140CSP is so small, it allows strategic placement on the circuit board, drastically reducing stray inductance and increasing overall circuit efficiency. The FlipKY device is lead-less, and minimizes lead inductance compared to all lead frame and axial packages.

Shawn O'Grady, Marketing Manager for Portable Products at International Rectifier, said, "The new FlipKY device has pushed the envelope for package size reduction in the Schottky diode market, and sets a new size-to-performance standard for future portable product designs."

Part Number	Package	IF (AVG)	VRRM	VF @1A, TJ=125°C(max.)	IRM @ VR(max.)
IR140CSP	FlipKY™	1A	40V	0.38V	80mA

Availability and Pricing

The new IR140CSP FlipKY device is available immediately, and is priced at US $0.25 each in 10,000-unit quantities.

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