EL SEGUNDO, Calif. January 2003 - International Rectifier, IR® (NYSE: IRF), introduces the IRF6156, a 20V dual bi-directional HEXFET® power MOSFET in a common drain configuration that is 80% smaller than devices in the TSSOP-8 package, with a profile less than 0.8mm. The IRF6156 is housed in the International Rectifier proprietary FlipFET™ package, the small size makes the IRF6156 ideal for Li-ion battery pack safety and protection circuits for cell phones, notebook computers, PDAs and digital cameras.

Li-ion battery packs are flammable, and require protection circuits to prevent damage from over-charging. A protection circuit is also required to detect a short circuit condition, and disconnect the battery from the load.

The proprietary FlipFET package uses no lead frame or mold compound. In essence, the die is the package, and reduces thermal resistance from junction-to-PCB to 35°C/W compared to >60°C/W for SO-8 package devices. In addition, thermal resistance junction-to-ambient is 50°C/W maximum. All of the IRF6156 terminals are on a single side of the die, so stray inductance and other device packaging losses are minimized or eliminated.

Shawn O'Grady, Marketing Manager for Portable Products at International Rectifier, said, "IR's FlipFET MOSFETs accommodate the ever-shrinking form factors of handheld applications without sacrificing current carrying capability. As a bonus for manufacturers, standard surface mount equipment and techniques can be used to mount the new device on a PCB."

Part Number	Package	VSSMax.(V)	RDS(on) Max@4.5V(mOhms)	ISAt 25°Cand VGS =4.5V(A)
IRF6156	FlipFET™	20V	34mOhms	6.7A

Availability and Pricing

The new IRF6156 MOSFET in the FlipFET package is available immediately. Pricing begins at US $0.80 each in 10,000-unit quantities.

High Resolution JPEGs are available in the Press Room.