International Rectifier's New SMD-0.5 Packs More Power into a Smaller Space
The combination of the new R5 RAD-HARD MOSFETs (die size 3) with the new SMD-0.5 package surpasses the previous
generation die size 5 in the SMD-1 package, improving performance in half the weight and size.
EL SEGUNDO, CA. January 1999 - International Rectifier (IR® introduces the new SMD-0.5 package,
with two times the power handling capability as the 18-pin Leadless Chip Carrier. This newest addition to IR's surface-mount family is
an alternative to popular LCC, TO-39 and the TO-257 packages. Designed to accommodate up to a die size 3, the new SMD-0.5 can
be used with any RAD-Hard® MOSFET, HEXFRED®
diodes, Schottky or standard HEXFET®
power MOSFET device.
At 1.0g and nominal dimensions of 0.296 x 0.400 x 0.115 inches, the SMD-0.5 is the most compact surface-mount package
available for space applications. In applications where the Coefficient of Thermal Expansion (CTE) mismatch between the hermetic
surface-mount package and the PC board are critical, the SMD-0.5 offers the small size allowing customers to qualify it for space-level
assemblies. Although designed to be mounted directly to the PC board, the SMD-0.5 is also available with attached leads.
The SMD-0.5 product line is ideal for power supply, motor drive, and linear regulator applications. Samples can be obtained
through International Rectifier's normal sales channels.
For more information:
Contact the Technical Assistance Center or
your local Sales Rep.
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