EL SEGUNDO, CA. January 1999 - International Rectifier (IR^® introduces the new SMD-0.5 package, with two times the power handling capability as the 18-pin Leadless Chip Carrier. This newest addition to IR's surface-mount family is an alternative to popular LCC, TO-39 and the TO-257 packages. Designed to accommodate up to a die size 3, the new SMD-0.5 can be used with any RAD-Hard^® MOSFET, HEXFRED^® diodes, Schottky or standard HEXFET^® power MOSFET device.

At 1.0g and nominal dimensions of 0.296 x 0.400 x 0.115 inches, the SMD-0.5 is the most compact surface-mount package available for space applications. In applications where the Coefficient of Thermal Expansion (CTE) mismatch between the hermetic surface-mount package and the PC board are critical, the SMD-0.5 offers the small size allowing customers to qualify it for space-level assemblies. Although designed to be mounted directly to the PC board, the SMD-0.5 is also available with attached leads.

The SMD-0.5 product line is ideal for power supply, motor drive, and linear regulator applications. Samples can be obtained through International Rectifier's normal sales channels.