The International Rectifier SMD-10 Package Offers 5- to 50-KW SMPS, Motor Drive and Welder Designers Cost-Effective Alternative to Large IGBT Modules
"This solution was designed to give our customers an innovative, flexible means for lowering the cost of their higher-power designs,
compared to large modules," says Chris Ambarian, director of switch technical marketing at International Rectifier.
EL SEGUNDO, CA. December 1997 - International Rectifier (IR) introduces the world's highest rated power surface-mount package -- the SMD-10.
When compared with competitive power modules, the new SMD10 solution provides the customer a 50% reduction in space, reduced
cost and greater manufacturing flexibility because of compatibility with modern pick-and-place manufacturing equipment.
In addition to its smaller size and ease of manufacturing, the SMD10 assembly also offers higher efficiency than other component
packaging regimens. Ultra low package inductance of 2 nH means less circuit noise and fewer or no snubbers, as well as cooler
devices in operation. IR has implemented 11 kW inverter stages with only 30 nH stray inductance (as opposed to 100-200 nH with
other modular solutions). The SMD-10 allows the assembly of power stages less than 12 mm high, including control PCB, while
modules typically have 31 mm height.
A greater than 60% exposure of solder surfaces allows ease of inspection. State-of-the-art silicon allows it to replace 2-4 paralleled
SMD TO-247 or D3PAK of similar voltage ratings.
International Rectifier is the world leader in power semiconductor technologies, and is committed to providing innovative packages
optimized for specific applications. The SMD-10 initial offering includes IGBTS, and IGBT/HEXFRED® CoPacks
for use in power supplies, motor drives and Uninterruptible Power Supplies (UPS). This package is so design friendly, due to an
intelligent layout of the device connections, that it can be used in virtually any circuit configuration with a minimum of inductance,
cross-talk and board space.
Power and control-connections are on opposite sides of the package for ease of paralleling (to increase output power to above the
before stated levels).
The first part available, the 600 V IRG4ZC70UD CoPack IGBT is rated at
a record breaking 100 A at Tc=25oC (50 A at Tc= 100oC), with a
Vce(on) of less than 1.9 V, while it switches off at benchmark speed 130 ns at 150oC, with total turn-on and
turn-off losses of 0.68 mJ/A off a 360 V bus, or 0.9 mJ/A off a 480 V bus, which includes losses induced by the state-of-the-art, ultrafast
HEXFRED freewheeling diode. This allows it to operate at higher efficiencies and higher power densities with less cooling than
competitive IGBTs and power MOSFETs in many applications.
Samples of the first devices are now available, with production runs starting in December, 1997 and January, 1998.
For more information:
Contact the Technical Assistance Center or
your local Sales Rep.
| 
