IRs New IGBT Modules Offer Lowest Switching and Conduction Losses for Power Conversion Applications
The low energy losses offered by IRs new IGBT modules translates into higher efficiency, lower junction temperatures, higher
reliability, reduced maintenance, and lower system cost in every high frequency power circuit.
EL SEGUNDO, CA. June 1997 - International Rectifier (IR) is introducing two new IGBT Power Module Series, one at 600 V and one at 1200 V,
with current ratings of 50 A - 500 A. These modules are optimized for high efficiency performance in the power conversion market and
are constructed in industry standard outlines.
Configured as single switches, high-side choppers, low-side choppers, and half-bridges - these modules are the perfect
choice for numerous high frequency power applications that demand high efficiency performance. They are designed for use as a
main switching device in switch mode power supply, uninterruptable power supply, welding, and induction heating applications.
Typical application circuits include boost and buck converters, forward and double forward converters, half bridges, full bridges
(H-bridge), and 3-phase bridges.
The new series features cleaner switching characteristics, generates less noise, and requires less snubbing in a power
conversion type system. The new INT-A-PAK and DUAL INT-A-PAK construction employs advanced materials and technologies
which allow replacement of multiple die that traditionally have been connected in parallel with a single larger device. This maximizes
silicon utilization efficiency and lowers the cost of the product. Such large die are made possible by IR’s new IGBT wafer fab in
Temecula, CA, which employs state-of-the-art equipment and processes, and is producing the world’s most efficient IGBTs.
Minimizing, and quite often eliminating, the necessity to parallel die significantly improves current sharing, lowers operating junction
temperature, and improves performance and reliability.
Electrically isolated from the circuit, the baseplate is exposed allowing for direct mounting to the heatsink, which meets
industry standards for safety. These modules also possess low thermal resistance, allowing the device to operate at higher case
temperatures while maintaining the operating junction temperature within safe limits. With improved current sharing and lower operating
junction temperatures, designers can now achieve higher system reliability.
For more information:
Contact the Technical Assistance Center or
your local Sales Rep.
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