EL SEGUNDO, CA, January 1997 - International Rectifier (IR) has introduced a new 6-pin, small-outline package to address the continuing needs of the portable electronics market for smaller footprints and lower costs. Termed the Micro6^TM, the package is only one-fourth the footprint of the popular SOIC 8-pin package, but achieves very similar power ratings.

The Micro6^TM employs a new lead frame design which dramatically increases the thermal transfer from the bottom of the chip through the leads of the package. By connecting four of the six leads directly to the chip's pad area, two on each side of the package, the heat is spread quickly over the maximum package footprint and printed circuit board area. As a result, the Micro6^TM offers similar power ratings, over 1.5W (continuous at TA=25C), as other much larger packages, such as the SO-8 or SOT-223, and very high power densities in excess of 150mW/mm2.

By comparison, the popular D-Pak and SOT-223 offer power densities of 30-40mW/mm2. "In turn, customers can shrink and reduce costs of their designs from older generation packages with the new Micro6^TM, with limited risk of exceeding maximum temperatures of the devices," says Gene Sheridan, Director, Battery Management Group at International Rectifier.

IR's first offering includes their market leading HEXFET Power MOSFETs. The first two devices are p-channel devices which utilize the latest advanced MOSFET technology and achieve an on-resistance, RDS(on), rating of only 0.2ohms maximum. When combined with the excellent thermal properties of this package, drain current ratings in excess of 2A are possible. The IRLMS5703 offers a -30V BVDSS rating with 0.2ohm specified at VGS=-10V, and it can be driven down to -4.5V as well. The IRLMS6702 provides a -20V BVDSS rating with 0.2ohm specified at VGS=-4.5V, while operating down to -2.7V, if needed. The devices are targeted for notebook and PDA load management switching, back-light inverters, cell phone power management, and 1-3A buck/boost converters. N-channel power MOSFETs, as well as other technologies, are planned for the Micro6^TM and will be available next year.

The Micro6^TM offers an excellent compliment to IR's existing lineup of small-outline power semiconductors for the portable electronics market. Over 50 part numbers are available in the existing SO-8, Micro8^TM, and Micro3^TM package styles, along with the industry-standard SMB and SMC used for Schottky rectifiers.

Both the Micro6^TM device types are now available in mass production. Data sheets are obtainable through the following hyperlinks, the Fax-On-Demand system (310-252-7105 in US, 44 1883 733 420 in UK), and international sales organization.

Part Number	Datasheet	Fax on Demand Doc#
IRLMS5703		91413
IRLMS6702		91414

Contact the Technical Assistance Center or your local Sales Rep.