From Planar to Trench - Evaluation of Ruggedness across Various Generations of Power MOSFETs and Implications on In-circuit Performance
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- Presented at APEC 2011
A Novel, High Efficiency Approach to Input Bridge
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- Presented at PCIM Europe 2008
Using Simulation to Estimate MOSFET Junction Temperature in a Circuit Application
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- Presented at Power Electronics Technology 2007 -
Choosing the Right Power MOSFET Package
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- as appeared in the Feb 2004 issue of EE Product News -
Design Considerations for a New Generation Mid-voltage Power MOSFET Technology
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- as presented at APEC 2005 -
Effect and Utilization of Common Source Inductance in Synchronous Rectification
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- as presented at APEC 2005 -
Analysis of Avalanche Behaviour for Paralleled MOSFETs
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- as presented at SAE World Congress 04 -
DirectFET® Power MOSFET Packaging Technology Enables Discrete Multiphase Converter Design Capable of up to 2MHz/phase Operation
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New Trench MOSFET Technology for DC-DC Converter Applications
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DirectFET® Technology: A Mechanically Robust Surface Mount Technology
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High Current Voltage Regulator Module (VRM) Uses DirectFET® MOSFETs to Achieve Current Densities of 25V/in2 at 1MHz to Power 32-bit Servers
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High Current Voltage Regulator Module Employs Novel Packaging Technology to Achieve over 100A in A Compact Footprint to Power Next Generation Servers
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DirectFET® - A Proprietary New Source Mounted Power Package for Board Mounted Power
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The Mechanical Ruggedness of DirectFET®
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20V MOSFETs for DC-DC Converters in Desktop Computers and Servers
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Bi-directional FlipFET® MOSFETs for Cell Phone Battery Protection Circuits
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FlipFET® MOSFET Design for High Volume SMT Assembly
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Power MOSFET Basics
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Paralleling of Power MOSFETs for Higher Power Output
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IGBT or MOSFET: Choose Wisely
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Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors
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Flip Chip MOSFET: A New Wafer Scale Packaging Technique
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