Power Electronics 101
Glossary of Acronyms
ABP: Annual Business Plan
AC: Alternating Current
AEA: American Electronics Association
ASIC: Application Specific Integrated Circuit
ASP: Average Selling Price
ASPR: Armed Services Procurement Regulation
ASQC: American Society of Quality Control
ATP: Availability to Promise
AZM: Area Zone Manager
BJT: Bipolar Junction Transistor
CAD: Computer Aided Design
CAM: Computer Aided Manufacturing
CEO: Chief Executive Officer
CESD: Customer Expected Ship Date
CFO: Chief Financial Officer
CMOS: Complementary Metal Oxide Silicon
DC: Direct Current
DESC: Defense Electronics Supply Council
DIP: Dual In-line Package
DMOS: Diffused Metal Oxide Silicon
DMR: Defective Material Report
DO: Second top rating in the Defense Priority System
DRAM: Dynamic Random Access Memory
DX: First top rating in the Defense Priority System
DZM: Distributor Zone Manager
EDI: Electronic Data Interchange
EDP: Electronic Data Processing
EMR: Electro Mechanical Relay
ESD: Electro-Static Discharge
ESL: Equivalent Series Inductance
ESR: Equivalent Series Resistance
ET: Executive Team
FAE: Field Application Engineer
FET: Field Effect Transistor
FOB: Freight-On-Board
FOD: Fax-On-Demand
FTG: Finished and Tested Goods (inventory)
GTO: Gate Turn Off (thyristor)
HEXFET: Registered trademark for International Rectifier's brand of power MOSFETs
HEXAM: IR Temecula or HEXFET America
IC: Integrated Circuit
IGBT: Insulated Gate Bipolar Transistor
IMS: Insulated Metal Substrate
IPM: Intelligent Power Module
IPS: Intelligent Power Switch
IRCI: International Rectifier Corporation Italy
IRGB: International Rectifier Great Britain
IRES: International Rectifier El Segundo
IRGmbH: International Rectifier Germany
IRJ: International Rectifier Japan Company, Ltd.
IRNY: International Rectifier New York
IRSEA: International Rectifier South East Asia
JAN: Joint Army Navy
JAN2N: QPL product with Group A, B. and C testing
JANTX2N: QPL product with Group A, B. C testing and 100% screening
JANTXV2N: QPL Product with Group A, B. C testing, 100% screening and pre-cap visual
inspection
JEDEC: Joint Electron Device Engineering Council
JIT: Just In Time (delivery)
LAN: Local Area Network
LCD: Liquid Crystal Display
LDMOS: L D Metal Oxide Silicon
LED: Light Emitting Diode
MARCOM: Marketing Communication
MCT: MOS Controlled Thyristor
MER: Micro Electronic Relay
MGD: MOSFET Gate Driver
MIS: Management Information Systems
MOS: Metal Oxide Semiconductor
MPS: Master Production Scheduling
MRA: Material Return Authorization
MRO: Maintenance, Repair and Operations
MRP: Material Requirements Planning
NPAT: Net Profit After Tax
MSP: Minimum Selling Price
OEM: Original Equipment Manufacturer
PDA: Percent Defective Allowable
PIP: Power Interface Products
POS: Point Of Sale
PVI: Photo Voltaic Isolator
PWM: Pulse Width Modulation
P&L: Profit & Loss
QA: Quality Assurance
QC: Quality Control
QPL: Qualified Products List
R&D: Research & Development
RAM: Random Access Memory
RFP: Request For Pricing
RFQ: Request For Quotation
RMS: Root Mean Square
ROW: Rest Of World
SCD: Source Control Drawing
SIA: Semiconductor Industry Association
SIP: Single In-line Package
SMC: Sales and Marketing Council
SMD: Surface Mount Device
SMD: Standard Military Drawing
SPC: Statistical Process Control
SPS: Standard Parts Stockroom
SSR: Solid State Relay
UPS: Uninterruptible Power System
VISION: Value-added Information Service Interactive On-line Network
WGM: Worldwide Gross Margin
WIP: Work In Progress
WSTS: World Semiconductor Trade Statistics
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