iPOWIR™ Building Blocks for Multiphase Buck Converters

iPOWIR Building Blocks for Multiphase Buck Converters The iP200x family of functional “building blocks” for multi-phase buck converters are used to power GHz class CPUs in high-end desktops, workstations and servers. Based on International Rectifier’s iPOWIR™ technology, the iP200x family integrates the power semiconductors, a driver IC and layout-critical passives required for each phase of a multiphase synchronous buck converter into a single ball grid array (BGA) or land grid array (LGA) package.

GHz class CPUs require lower voltages, higher currents and faster transient response, all this in reduced solution footprints. Higher power density and transient response requirements can only be achieved by reducing the size of passives and increasing operating frequencies. However, increased emphasis on power density and higher operating frequencies can lead to greater layout challenges and higher parasitic losses.

THE IR ADVANTAGE
Replaces up to 10 discretes per phase
Switching frequency up to 1MHz per phase
Up to 44% footprint reduction over discrete solutions
No current derating up to 100°C PCB temperature
Saves up to 3 months in design time
APPLICATIONS
High-current multiphase synchronous buck converters to power:
  • CPUs in high-end desk tops, servers, and work stations
  • Network processing units (NPUs) and application-specific ICs (ASICs) used in net-working, telecom switchers and routers
The iPOWIR technology platform at International Rectifier capitalizes on proprietary multi-chip packaging, opening the doors to new levels in power density and enabling the performance required by future converters. The iPOWIR technology is an example of IR’s power management expertise in all areas and is much more than simply integrating functions. Benchmark power semiconductors are matched with control ICs, optimized packaging and advanced system design. Only when all of these aspects are combined can complete functionality be bundled into a tiny, easy to design solution.

Integration reduces parasitic losses enabling the devices to achieve high efficiency, while reducing solution footprint by up to 44%. Design time and effort are reduced because one device replaces up to 10 discrete components per phase, significantly reducing part count. The iP200x family of devices requires only a multiphase PWM IC, input and output capacitors and output inductors to enable the design of a fully functional mutiphase buck converter.

Specifications
Part Number VIN VDD VOUT IOUT (max) Frequency Package
iP2001 5-12V 5V 0.9-3.3V 20A 250-1000kHz 11mm x 11mm x 3mm BGA
iP2002 2.5-12V 5V 0.9-3.3V 30A 250-1000kHz 11mm x 11mm x 2.6mm BGA
iP2003A 3-13.2V 5V 0.8-3.3V 40A 300-1000kHz 11mm x 9mm x 2.2mm LGA
iP2005A 6.5-13.2V 5V 0.89-5.5V 40A 250-1500kHz 7.7mm x 7.7mm x 1.7mm LGA


iP200x Functional Block Diagram

Simple Recipe to Design High-Current, Single Phase Converters:
1 iP200x per phase
1 multiphase controller IC
Input and output capacitors
Output inductors
Lay out above components to meet space requirements

Reference designs demonstrate this innovative technology for the high-current and fast transient response times required in today’s power-hungry CPUs, NPUs and ASICs. The IRDCiP2001-C, four-phase reference design offers up to 88.5% efficiency at 80A full load, 1.6VOUT and 500kHz in still air.

Reference Design Kit Specifications: VIN - 5-12V, VOUT - 1-2V
Reference Design Kit Number No. of Phases Switching Frequency Output Current
IRDCiP2001-A 2 500kHz per phase 40A
IRDCiP2001-B 3 500kHz per phase 60A
IRDCiP2001-C 4 500kHz per phase 80A
IRDCiP2002-C 4 1MHz per phase 120A
IRDCiP2003A-C 4 1MHz per phase 160A
IRDCiP2005A-A 2 1MHz per phase 80A