|
Quality Conformance and Screening
|
The screening and testing sequences of all MIL-Qualified products are standardized around the general specifications noted on the Quality Conformance Testing page. The screening and testing flows detailing the qualification process to these general specifications are referenced below:
|
|
Screening Requirements
MIL-PRF-19500
MIL-STD-883
MIL-PRF-38534
MIL-PRF-19500 Inspections
MIL-PRF-19500 Group A (Electrical)
MIL-PRF-19500 Group B (Mechanical - JANS)
MIL-PRF-19500 Group B (Mechanical - JANTX, JANTXV)
MIL-PRF-19500 Group C (Reliability)
MIL-PRF-19500 Group D (Radiation Hardness Assurance)
MIL-PRF-19500 Group E (Package Qualification)
|
Testing Requirements
MIL-PRF-38534 Group A (Electrical)
MIL-PRF-38534 Group B
MIL-PRF-38534 Group C
MIL-PRF-38534 Group D (Package Qualification)
MIL-PRF-38535 Group A (Electrical)
MIL-PRF-38535 Group B
MIL-PRF-38535 Group C
MIL-PRF-38535 Group D
|
|
MIL-PRF-19500 Screening Requirements |
| Test/Inspection |
Screening Level |
MIL-STD-750
Method |
| JANTX |
JANTXV |
JANS |
| Internal visual inspection (precap) |
- |
100% |
100% |
2073, 2074, 2072 |
Temperature cycling (temp. cycle)
20 cycles > 10 minutes @
temperature extremes |
100% |
100% |
100% |
1051 |
| Thermal impedance |
100% |
100% |
100% |
3161, 3101, 3103 |
| Constant acceleration 20kG or 10kG > 10W |
- |
- |
100% |
2006 |
Particle impact noise detection
(PIND - devices with internal cav.) |
- |
- |
100% |
2052
Condition A |
| Serialization of devices |
- |
- |
100% |
|
| Interim electrical parameters |
- |
- |
100%
R&R |
|
High temperature gate bias
(within x hrs)
MOSFETs/IGBTs: |
100%
(48 hrs) |
100%
(48 hrs) |
100%
(48 hrs) |
1042
Condition B |
Interim electrical
and delta parameters
(within x hrs) |
100%
(24 hrs) |
100%
(24 hrs) |
100%
(16 hrs) |
|
High temperature reverse bias
(hours minimum)
MOSFETs/IGBTs:
Diodes: |
100%
(160 hrs)
100%
(96 hrs) |
100%
(160 hrs)
100%
(96 hrs) |
100%
(240 hrs)
100%
(240 hrs) |
1042
Condition A
1038
Condition A |
Final electrical test
and delta parameters |
100% |
100% |
100% |
|
| Hermetic seal (fine and gross leak) |
100% |
100% |
100% |
1071 |
| Radiography |
- |
- |
100% |
2076 |
External visual exam
(after complete marking) |
- |
- |
100% |
2071 |
Case Isolation
(Case Isolated Packages) |
100% |
100% |
100% |
1081 |
|
|
|
MIL-STD-883 Screening Requirements
for class level S and level B |
| Test/Inspection |
Screening Level |
MIL-STD-883
Method |
| Level B |
Level S |
| Non-destructive bond pull |
- |
* |
2023 |
| Internal visual inspection |
100% |
100% |
2010, condition B for class level B
2010, condition A for class level S |
| Temperature cycling |
100% |
100% |
1010, condition C |
| Constant acceleration |
100% |
100% |
2001, condition E |
| External visual inspection |
100% |
100% |
|
Particle impact noise detection
(PIND) |
- |
100% |
2020, condition A for class level S |
| Serialization |
1 |
100% |
|
| Preburn-in electrical parameters |
100% |
100% |
|
| Burn-in |
100%
160 hours |
100%
240 hours |
1015 |
| Interim electrical parameters |
- |
100% |
|
| High temperature reverse bias (HTRB) |
- |
100%
72 hours |
1015, condition A or C |
| Interim electrical parameters |
100% |
100% |
|
Percent defective allowable
(PDA) calculation |
5% |
5% |
|
Final electrical test
Static @ 25°C
Static @ min and max temps
Switching test @ 25°C |
100%
100%
100% |
100%
100%
100% |
|
| Hermetic seal (fine and gross leak) |
100% |
100% |
1014 |
| Radiography |
- |
100% |
2012 |
| External visual inspection |
100% |
100% |
2009 |
* Process Monitor
|
|
|
|
MIL-PRF-38534 Screening Requirements |
| Test/Inspection |
Screening Level |
MIL-STD-883
Method |
| Class H |
Class K
(Space Level) |
| Pre Seal Burn-in |
Optional |
Optional |
1030 |
| Nondestructive bond pull |
N/A |
100% |
2023 |
| Internal visual |
100% |
100% |
2017 |
| Temperature Cycle |
100% |
100% |
1010 |
| Constant acceleration |
100% |
100% |
2001 |
| Mechanical shock |
100% |
100% |
2002 |
| Particle impact noise detection (PIND) |
N/A |
100% |
2020 |
| Preburn-in electrical |
Optional |
100% |
|
| Burn-in |
100% |
100% |
1015 |
| Final electrical |
100% |
100% |
|
| Seal |
100% |
100% |
1014 |
| Radiographic |
N/A |
100% |
2012 |
| External visual |
100% |
100% |
2009 |
|
| The HiRel Products Group has also established standard, cost-effective screening programs known as the QIRL and OM803 program. Standard "off the shelf," Space, JANTXV or JANTX level product can be designated as QIRL. These products are fully compliant with all screening and Quality Conformance Inspection (QCI) requirements of MIL-PRF-19500 for Space, JANTXV or JANTX levels. They meet the same data sheet electrical and mechanical specifications, and are produced and tested on a JANS qualified line. The OM803 screening program was developed to offer low-cost screening to our customers while using methods and conditions defined in MIL-STD-750 and MIL-STD-883. The OM803 screening program is performed on all Omnirel standard products.
|
Note 1: Level 2 devices- burn-in time is 48 hours minimum, Level 3 devices - burn-in time is 160 hours minimum.
Note 2: PDAs apply to burn-in and post electricals only.
Note 3: When ordering "P" level devices, the letter "P" is not marked on the device.
|
MIL-PRF-19500 Group A Inspection
Electrical Verification |
Sub
Group |
Parameters |
JANS
Quantity
(accept number) |
JANTX, JANTXV
Quantity
(accept number) |
| 1 |
Visual and mechanical inspection |
15 (0) |
45 (0) |
| 2 |
DC (static) test at +25°C |
116 (0) |
116 (0) |
| 3 |
DC (static) tests at max. and min. temps. |
| 4 |
Dynamic tests at +25°C |
| 5 |
Safe operating area test (power trans.):
a. DC
b. Clamped inductive
c. Unclamped inductive
End point electrical measurements |
45 (0) |
45 (0) |
| 6 |
Surge current (diodes and rectifiers)
End point electrical measurements |
22 (0) |
| 7 |
Selected static and dynamic tests |
|
|
|
MIL-PRF-19500 Group B Inspection
Mechanical Verification |
Sub
Group |
Parameters |
JANS, Large Lot
Quantity
(accept number) |
JANS, Small Lot
Quantity
(accept number) |
| 1 |
Physical dimensions |
22 (0) |
8 (0) |
| 2 |
Solderability |
15 leads (0) |
6 leads (0) |
| Resistance to solvents |
15 (0) |
6 (0) |
| 3 |
Temperature cycling (100 cycles) |
22 (0) |
6 (0) |
| Surge (diodes only) |
| Hermetic seal (fine and gross leak) |
| Electrical measurements |
| Decap internal visual |
6 (0) |
6 (0) |
| Bond strength |
22 wires (0) or 11 (0) |
12 wires (0) or 6 (0) |
| SEM (when specified)* |
6 (0) |
|
| Die shear |
11 (0) |
6 (0) |
| 4 |
Intermittent op. life
Electrical measurements |
22 (0) |
12 (0) |
| 5 |
Accelerated HTRB (120 hours) |
22 (0) |
12 (0) |
| Electrical measurements |
| Accelerated HTGB (24 hrs) |
| Electrical measurements |
| Bond strength |
22 wires (0) |
20 wires (0) |
| 6 |
Thermal resistance |
22 (0) |
12 (0) |
| 7 |
High Temp Life (340 Hours Non-Operating) |
32 (0) |
12 (0) |
| Electrical |
|
|
*Note: Not applicable for Schottky's
|
MIL-PRF-19500 Group B Inspection
Mechanical Verification |
Sub
Group |
Parameters |
JANTX, JANTXV
Large Lot
Quantity
(accept number) |
JANTX, JANTXV
Small Lot
Quantity
(accept number) |
| 1 |
Solderability |
15 leads (0) |
4 leads (0) |
| Resistance to solvents |
15 (0) |
3 (0) |
| 2 |
Temperature cycling
(45 cycles, including screening) |
22 (0) |
6 (0) |
| Thermal shock (10 cycles) |
| Hermetic seal (fine and gross leak) |
| Electrical measurements |
| 3 |
Steady state op. life or
intermittent op. life |
45 (0) |
12 (0) |
| Electrical measurements |
| Bond strength |
11 wires (0) |
11 wires (0) |
| 4 |
Decap internal visual |
1 (0) |
1 (0) |
| 5 |
Thermal resistance (Performed 100%) |
15 (0) |
6 (0) |
| 6 |
High temperature life (340 hours) non-operating* |
32 (0) |
12 (0) |
| Electrical measurements |
|
|
*Note: Not applicable for power MOSFETs
|
MIL-PRF-19500 Group C Inspection
Long-term Reliability Verification |
Sub
Group |
Parameters |
All Quality Levels
Large Lot
Quantity
(accept number) |
All Quality Levels
Small Lot
Quantity
(accept number) |
| 1 |
Physical dimensions |
15 (0) |
6 (0) |
| 2 |
Thermal shock |
22 (0) |
6 (0) |
| Terminal strength |
| Hermetic seal (fine and gross leak) |
| Moisture resistance |
| Electrical measurements |
| 3 |
Shock |
22 (0) |
6 (0) |
| Vibration, variable frequency |
| Constant acceleration |
| Electrical measurements |
| 4 |
Salt atmosphere (corrosion) |
15 (0) |
6 (0) |
| 5 |
N/A |
|
|
| 6 |
Steady state op. life or
intermittent op. life or blocking life |
22 (0) |
12 (0) |
| Electrical measurements |
| 7 |
Internal water vapor |
3 (0) |
3 (0) |
|
|
|
MIL-PRF-19500 Group D Inspection
Radiation Hardness Assurance Program |
Sub
Group |
Parameters |
JANTXV
Inspection Lot
Quantity
(accept number) |
JANS Wafer
Inspection Lot
Quantity
(accept number) |
| 2 |
Steady-state total dose irradiation |
|
|
| Qualification |
11 (0) |
4 (0) See note 1.
2 (0) See note 2.
1 (0) See note 3. |
| CI |
11 (0) |
4 (0) See note 1.
2 (0) See note 2.
1 (0) See note 3. |
|
1. For device types ≥ 4,000 die per wafer
2. For device types > 500 and < 4,000 die per wafer
3. For device types ≤ 500 die per wafer
|
MIL-PRF-19500 Group E Inspection
Package Qualification |
Sub
Group |
Parameters |
All Quality Levels
Quantity
(accept number) |
| 1 |
Thermal shock (100 cycles)
or
Temp. cycling (500 cycles min.)
Electrical Measurements |
per MIL-PRF-19500 |
| 2 |
Steady state op. life
Electrical measurements |
per MIL-PRF-19500 |
| 4 |
Thermal resistance |
22 (0) |
| 5 |
Barometric pressure
(derives with rated voltage > 200V |
15 (0) |
| 6 |
ESD |
3 (0) |
|
|
|
|
MIL-PRF-38534 Group A Electrical Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Static tests at +25°C |
116 (0) |
| 2 |
Static tests at max. rated operating temp. |
76 (0) |
| 3 |
Static tests at min. rated operating temp. |
45 (0) |
| 4 |
Dynamic test at +25°C |
116 (0) |
| 5 |
Dynamic tests at max. rated operating temp. |
15 (0) |
| 6 |
Dynamic tests at max. rated operating temp. |
45 (0) |
| 7 |
Functional tests at +25°C |
116 (0) |
| 8 |
Functional tests at max. and min. rated operating temp. |
76 (0) |
| 9 |
Switching tests at +25°C |
116 (0) |
| 10 |
Switching tests at max. rated operating temp. |
76 (0) |
| 11 |
Switching tests at min. rated operating temp. |
45 (0) |
|
|
|
|
MIL-PRF-38534 Group B Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
Class |
| K |
H |
| 1 |
Physical dimension |
2 (0) |
X |
X |
| 2 |
PIND |
15 (0) |
X |
|
| 3 |
Resistance to solvents |
3 (0) |
X |
X |
| 4 |
Internal visual and mechanical |
1 (0) |
X |
X |
| 5 |
Bond strength:
a. Thermocompression
b. Ultrasonic or wedge
c. Flip-chip
d. Beam lead |
2 (0) |
X |
X |
| 6 |
Die shear strength |
2 (0) |
X |
X |
| 7 |
Solderability |
1 (0) |
X |
X |
| 8 |
Seal:
a. Fine
b. Gross |
15 (0) |
|
X |
| 9 |
ESD:
a. Electrical parameters
b. ESDS
c. Electrical parameters |
3 (0) |
X |
X |
|
|
|
|
MIL-PRF-38534 Group C Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
Class |
| K |
H |
| 1 |
External visual |
5 (0) |
X |
X |
| PIND |
X |
X |
| Temperature cycling |
X |
|
Temperature cycling or
Thermal shock |
|
X
X |
Mechanical shock and/or
Constant acceleration |
X
X |
X
X |
| Seal (fine and gross) |
X |
X |
| PIND |
X |
X |
| Visual examination |
X |
X |
| End-point electrical |
X |
X |
| 2 |
Steady-state life test |
22 (0) or 5 (0) |
X |
X |
| End-point electrical |
X |
X |
| 3 |
Internal water vapor content |
3 (0) or 5 (1) |
X |
X |
| 4 |
Internal visual and mechanical |
2 (0) |
X |
X |
| Wire bond strength |
X |
X |
| Element shear |
X |
X |
|
|
|
|
MIL-PRF-38534 Group D Package Related Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Thermal shock |
5 (0) |
| Stabilization bake |
5 (0) |
| Lead integrity |
1 (0) |
Seal:
a. Fine
b. Gross |
5 (0) |
| 2 |
Moisture resistance |
5 (0) |
| 3 |
Salt atmosphere |
5 (0) |
| 4 |
Metal package isolation |
3 (0) |
|
|
|
|
MIL-PRF-38535 Group A Electrical Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Static tests at +25°C |
116 (0) |
| 2 |
Static tests at max. rated operating temp. |
116 (0) |
| 3 |
Static tests at min. rated operating temp. |
116 (0) |
| 4 |
Dynamic tests at +25°C |
116 (0) |
| 5 |
Dynamic tests at max. rated operating temp. |
116 (0) |
| 6 |
Dynamic tests at min. rated operating temp. |
116 (0) |
| 7 |
Functional tests at +25°C |
116 (0) |
| 8 |
Functional tests at max. & min. rated operating temp. |
116 (0) |
| 9 |
Switching tests at +25°C |
116 (0) |
| 10 |
Switching tests at max. rated operating temp. |
116 (0) |
| 11 |
Switching tests at min. rated operating temp. |
116 (0) |
|
|
|
|
MIL-PRF-38535 Group B Testing |
Sub
Group |
Parameters |
Minimum Sample Size
Quantity (accept number) |
| 1 |
Resistance to solvents |
3 (0) |
| 2 |
Bond strength:
a. Thermocompression
b. Ultrasonic
c. Flip-chip
d. Beam lead |
22 (0)
Based on the number of wires |
| Die shear test or stud pull |
3 (0) |
| 3 |
Solderability |
per MIL-PRF-38535 |
|
|
|
|
MIL-PRF-38535 Group C Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Steady-state life test
End-point electrical parameters |
45 (0) |
|
|
|
|
MIL-PRF-38535 Group D Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Physical dimensions |
15 (0) |
| 2 |
Lead Integrity
Seal (fine and gross) |
15 (0) |
| 3 |
Thermal Shock
Temperature Cycling
Moisture resistance
Seal (fine and gross)
Visual
End-point electricals |
15 (0) |
| 4 |
Shock
Vibration, variable frequency
Acceleration
Seal (fine and gross)
Visual |
15 (0) |
| 5 |
Salt atmosphere
Seal (fine and gross)
Visual |
15 (0) |
| 6 |
Internal water vapor (cavity packages) |
3 (0) or 5 (1) |
| 7 |
Adhesion of lead finish |
15 (0) |
| 8 |
Lid torque |
5 (0) |
|