Epitaxy for Si Power Devices

IR provides outsourced services for Si epitaxy used in power device applications. Production proven epitaxial processes are available for power MOSFETs, bipolar power discrete devices, and power control integrated circuits. IR has production processes for epitaxy on heavily doped Sb, As, B and P (including red-phosphorus) substrates as well as thin substrates used to minimize RDS-ON device performance.

In addition to providing epi on bare substrates we process epitaxy on substrates with buried layers for power management integrated circuits. Epi processes for substrates with buried layers containing As, B, P or Sb, and combinations of these buried layers, are available using atmospheric pressure and/or reduced pressure processing.

IR Epitaxial Services operates 24 hours per day and 7 days per week in order to meet the needs of our customers for short turn-around time. Our customer base is world-wide and includes some of the largest names in semiconductor manufacturing as well as research institutes and universities.

IR Epitaxial Services is QS-9000, ISO 9001:2000 and ISO 14001 certified. Certification to the ISO/TS 16949 standard is scheduled to occur during Q3-CY2005.