DirectFET®; MOSFET: X-ray Inspection
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If you want to inspect the hidden (gate and source) solder joints under the package, the only methods that
will work are x-ray and sideways looking cameras:
- X-ray is the preferred method.
- X-ray inspection allows the complete diagnosis of solder joint quality.
- Voiding, solderballing, poor jointing etc can all be viewed using x-rays.
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"Play Audio
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X-Ray Inspection - Example Images
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Solder Balling
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Poorly Formed Joints
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IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and
other US and foreign pending patent applications.
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