Interface Materials	Features	Thermal Conductivity W/m-K	Thickness (mil)	Imax (amp)
GPA3000	Highly conductive gap filler polymer laminate	3	20	105.9
			15	104.9
SPA2000	Sil-Pad, thermally conductive silicon elastomer	3.5	15	96.9
GPVO, Ultra Soft	Highly conformable used for uneven surface	1	20	97.9
			40	95.9
Bond Ply 100	Double sided tapewith bond strength	0.8	8	92.9

Material Class	Description	Benefits	Drawbacks	Bulk K (W/mK)	Surface Wetting	Surface Conforming	Vendors
Grease	These are the traditional TIMs filled with conductive particles of Al2O3, BeO, Al, Ag, etc.	Can achieve very thin bond lines <0.005"	Difficult to apply to assemblies Messy Typically pumps out affecting long-term reliability Requires controlled dispensing No electrical isolation	0.3-2 Al filled 6+	Very Good	Very Good	Hi-K Grease Shinetsu Bergquist
Gel	Grease replacement that closs-links during cure to form a gel-like substance	Can achieve very thin bond lines <0.005" Does not pump out	Cannot be preapplied to assemblies Requires cure which can be from burn-in Messy Requires controlled dispensing No electrical isolation	0.3-2	Very Good	Very Good	Thermoset-Lord MG Series
Adhesive	Heat cured adhesives filled with conductive particles similar to grease	Can achieve very thin bond lines <0.005" Mechanical and thermal attach	Cannot be preapplied Typically requires process oven curing Messy Requires controlled dispensing Typically no electrical isolation	0.3-1.3	Very Good	Very Good	Dow Corning 3M
Tape	Usually pressure sensitive adhesive filled with conductive particles on a fiberglass or plastic carrier	Mechanical and thermal attach Can be die cut and preapplied Clean, simple processing Typically electrical isolating	Typically thick bondlines with low conductivity	0.7-1.5	Moderate	Poor	Bergquist 3M Dow Corning
Phase Change	A waxy type material that changes to a gel at apporximately 50°C, allowing it to conform to surface irregularities. Can be preapplied or supplied on a carrier	Can achieve very thin bond lines <0.005" when preapplied Fairly clean process With carrier has electrical isolation	Typically low thermal conductivity The phase change material itself is usually very thin and does not conform to large irregularities	0.8-1.5	Very Good	Very good for irregularities <0.002" Very poor for large irregularities or bowing	Bergquist 3M Dow Corning
Pads	Typically thick materials 0.010"-0.250" thick. Some are very compliant with a low K and others are not very compliant with a reasonably high K	Simple to use Can typically be re-used Can be die-cut and preapplied Clean process	Typically requires moderate to high pressuresto achieve reasonable performance - can be tricky to use effectively Typically do not conform well to small surface irregularities Thick bondlines	0.8-4	Poor	Very good for large irregularities Very poor for small irregularities	Bergquist 3M Dow Corning