INTERNATIONAL RECTIFIER - THE POWER MANAGEMENT LEADER

DirectFET® MOSFET: Device Soldering Considerations

Voiding



The above images show approximately 20% voiding.

Solder-Balling


Gross Solder-Balling

Acceptable Solder-Balling
  • Both of these devices used the same stencil and reflow profile but different solder pastes
  • Solder paste behavior and reduction is to some extent dependant on solder paste rheology and wetting

Component Tilt

While not desirable, it is possible for devices with up to 3° of tilt to be fully soldered and not show reliability issues.

NOTE: if you are using a top side heatsink, you may have problems mounting heatsinks to tilted devices.

Post Placement Tilt
Tilt on devices post placement can only occur if the pick and place machine is not placing them on the board flat. The reasons for this could be that the machine is damaged or that the board is not flat.

If the machine is at fault then the devices are likely to tilt in the same direction relative to the component orientation. Other devices are also likely to be affected.

If it is board related then devices are likely to vary across the board. Look to see if:

  • Boards are bowed prior to an assembly
  • Boards are supported in pick & place machine (additional supports under the centre of the panel may be required if board is very flexible)
  • Board is not deflection due to excessive over-travel

Component Twist

  • Slight twist may occur on some devices
  • If the pad is to IR’s design and the device sits within the pad perimeter then no problems should occur


Tombstoning
  • The effect is rare
  • Tombstoning is caused by differential surface tensions across the device, uneven heating rates are a likely cause

This is really undesireable!
NOTE: N2 purge can increase the likelihood of tombstoning

Manufacturing Case Study
Initial Reported Problem:
    “…shorted devices on server boards assembled for end customer.”
Initial Information Gathered:
    There were two boards designs: A1 and A2

    Only one board (A1) was exhibiting this problem

    A1 had been designed by one location, a second location designed A2

Images from A1

MT

MQ
  • While the report contained a reasonable amount of background information, there was not enough to draw full conclusions
  • The two images of the board suggested board and stencil design as possible causes of the problems


  • An x-ray image of the high side FET showed that the solder pads were too big on the PCB
  • The solder can be clearly seen at the edge of the die, which will result in shorting.
 
MQ                 MT
  • White areas are where customer's and IR’s recommended designs match
  • Light green areas are where customer’s design was larger than IR’s
  • Pink areas are where IR’s design was larger than customer’s

  • The A1 board and stencils were redesigned to match our recommended footprints and the issues of shorting disappeared

IR’s proprietary DirectFET® technology is covered by US Patent 6,624,522 and other US and foreign pending patent applications.

 
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Board Mount Fundamentals
   Checking Pad Outlines
    Stencil PCB Design
    MicroStencil Kits
   Reflowing
    Soldering Considerations
      Device Tilt & Tombstoning
      Solderballing
      Voiding
    X-ray Inspection
   Solder Paste
    Cleaning the DirectFET
   Device On-Board Placement
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