Component Tilt
While not desirable, it is possible for devices with up to 3° of tilt to be fully soldered and not show reliability issues.
NOTE: if you are using a top side heatsink, you may have problems mounting heatsinks to tilted devices.
|
Post Placement Tilt
Tilt on devices post placement can only occur if the pick and place machine is not
placing them on the board flat. The reasons for this could be that the machine is
damaged or that the board is not flat.
If the machine is at fault then the devices are likely to tilt in the same direction
relative to the component orientation. Other devices are also likely to be affected.
If it is board related then devices are likely to vary across the board.
Look to see if:
- Boards are bowed prior to an assembly
- Boards are supported in pick & place machine (additional supports under
the centre of the panel may be required if board is very flexible)
- Board is not deflection due to excessive over-travel
|