DirectFET MOSFET Reworking Process
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- DirectFET devices may be reworked in a production environment by using standard BGA an CSP type reworking stations.
- These reworking stations are equipped to allow the removel of the device, remounting and reflowing of the device.
In most cases, there is also a provision to allow the deposition of the new solder paste via a micro-stencil that can be
attached to the machine.
- Step-by-Step DirectFET® Rework With Microscreen QuickTime Movie (4.3MB)
IR’s proprietary DirectFET® technology is covered by US Patent 6,624,522 and
other US and foreign pending patent applications.
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