• Higher performance in same size
  • Highest current density once again
• Same board size, more output power
• IRF6644 + IRF6613 Replace 2xIRF7495 + 2xIRF7842

• Heat – thermal dissipation per in²
• DirectFET MOSFETs are the first surface mount products to make a significant change to the method of removing heat from high density circuits
  • It also has the lowest package resistance,
  • Lowest inductance and profile
• Hi density
• DirectFET MOSFETs small size, ease of layout, low profile and low parasitic impedances make high density possible if High frequency is desired
• DirectFET MOSFETs allow heat to be removed from both the top and the bottom, enabling higher density designs
• Reduces the cost of this improved performance

• Replace two industry-best 100VN/80VN primary side SO-8s (or Power Paks) with a single DirectFET MOSFET in 48Vin, 240W Half-Bridge DC Bus Converter
• Keep the gate charge of single DirectFET MOSFET below 50nC in order not to overheat the driver

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• IRF6644 has significantly lower temp than SO8 devices
  • Cooler = higher reliability
  • Generally, Failure rate is reduced 50% for each 10 C reduction
• Primary and secondary DirectFET temps are now balanced!
  • Allows higher power, lower $/amp or higher reliability

• Non Isolated Synchronous Buck modules operating from 28V or higher.
• DC Buss converters secondary.
• Isolated DC-DC converters with wide input range.

• Synchronous rectification for AC-DC power supplies.
• DC Buss converters with ½ Bridge primary.
• 48V input Isolated DC-DC converters with ½ Bridge input.