Patented DirectFET™ technology produces the first surface mount package designed from the ground up for power semiconductors. It has a uniquely simple construction that provides breakthroughs in die free package resistance and heat dissipation capabilities, dramatically increasing the efficiency and current carrying capability of the device in a given footprint. This new package is compatible with today's high-volume manufacturing processes. The DirectFET User's Guide has been developed to provide an overview of DirectFET technology and how to use it successfully in high-volume manufacturing environments.

International Rectifier DirectFET® MOSFETs win prestigious 'R&D 100 Award', 'Top 10 DC-DC 2003 Award' and 'Product of the Year Award'.