DirectFET®; MOSFET: Checking Pad Outlines
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DirectFET MOSFET Pads and Outlines
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DirectFET MOSFET Outlines
The new method of outline identification breaks all devices up into 3 die sizes* within each can.
* Each die size has it’s own specific pad layout. Refer to datasheets for exact dimensions.
Refer to the following URL for further details:
/technical-info/appnotes/an-1035.pdf
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Drain Rails: Optimized Pad Designs
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Why Split Drain Rails?
Are you experiencing manufacturing problems like these?:
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Device placed tilted:
- Damaged rubber pickup tip?
- Warped pcb?
- Off-center pickup?
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Device pushed into solder, displacing solder along full length of drain rail |
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Post reflow device will have recovered some tilt but surface tension will not have been enough to give full correction |
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Device placed tilted:
- Damaged rubber pickup tip?
- Warped pcb?
- Off-center pickup?
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Device pushed into solder, displacing solder but in two smaller amounts that do not join |
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During reflow the surface tension is effectively increased and solder does not have to flow as far to recover a ‘flat position
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Solder Mask Defined vs. Non-Solder Mask Defined Pads
IR recommends solder mask defined pads for use with DirectFET MOSFETs
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Solder Mask Defined Pad
Recommended for use with DirectFET MOSFETs |
Non-Solder Mask Defined Pad
Not good where pad size is critical as it is with DirectFET MOSFETs |
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Example of Non-Solder Mask Defined Pads
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IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and
other US and foreign pending patent applications.
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