Get it from Application Note AN-1035 at www.irf.com

Please note that it is critical that the pad outlines on the board are checked as boards delivered from PCB vendor may differ from original gerber design files

1. Ensure that the temperature profile seen by the DirectFET MOSFET meets at the least the minimum profile requirements as specified by the solder paste vendor.

2. Temperature profile of the DirectFET MOSFET must be measured underneath / at the DirectFET MOSFET with a thermocouple ‘buried’ in the board.

Solder paste volume is critical to achieving good solder joint quality and high production yields.

Ensure the ratio of solder paste volume to PCB pad area is correct.

There are recommended stecils designs for each of IR’s DirectFET MOSFET outlines based on a 6mil/150um thick stencil. These recommendations can be found in the “Stecil Design” section, or in the Application Note AN-1035, or on the device datasheet.

In order for all DirectFET MOSFET solder connections to be made, the Pick & Place machine should be set to give a placement force of 150 – 250g and/or an overtravel into the printed solder paste of 0.05 – 0.10mm (0.002 – 0.004”)

If pad numbering is required to produce a component outline within the library of a CAD system, International Rectifier recommends that the convention shown in Fig. 2 is adopted. This makes it easier to discuss any issues that may arise during design and assembly.