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Introduction to DirectFET®; Technology

What is a DirectFET MOSFET?
DirectFET is the first new package in 20 years designed from the beginning to be a surface mount power package. It is targeted to optimize the heat transfer from power MOSFETs while minimizing the package parasitic impedances such as package resistance and inductance to enable the highest frequency and current carrying power circuits.

It enables systems packaging engineers to utilize 3D packaging to obtain lower circuit impedance on one side and low thermal impedance on the other similar to large modules and hockey puck packages of the past except in a surface mountable modern package.

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DirectFET MOSFET History
In 2000, most Semiconductor suppliers recognized the need for an improved SO-8 package. Only IR took the bold set to solve both package resistance and system thermal impedance problems. The Media embraced this as “The Package for the Future:
  • Captured more front covers of trade journals in the US, Europe, Asia, Japan
  • Multiple articles in leading trade magazines since being launched in 2001.
  • Product of the year (2003)

IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and other US and foreign pending patent applications.

 
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Introduction to DirectFET Technology
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