DirectFET MOSFET History
In 2000, most Semiconductor suppliers recognized the need for an improved SO-8 package. Only IR took the bold set to solve both package resistance and system
thermal impedance problems. The Media embraced this as “The Package for the Future:
- Captured more front covers of trade journals in the US, Europe, Asia, Japan
- Multiple articles in leading trade magazines since being launched in 2001.
- Product of the year (2003)

IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and
other US and foreign pending patent applications.
|