DirectFET®; MOSFETs: Miniature Heat Sinks
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Recent Supplier Development of Miniature Heat Sinks
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Cool Innovations
- Pin fin products
- Aluminium or Copper base plate with extended fin structure
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Schneider Clauss
- Pinbloc products
- Injection molded pins
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Miniature Heat Sinks: Pin Fin Trials
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Pin Fin Thermal Resistance Trials
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Effect of Heat Sink on DirectFET MOSFET Reliability
- Aluminum block heatsink
- Adhered to top of the can ‘M’ with thermal epoxy
- Power cycled so junction cycled from 35°C to 105°C (2mins on, 2mins off)
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Heat Sink Power Cycling Results
- Shift with heatsink was approx 33% of the shift seen on parts without heatsink. This is less than found with encapsulated devices and well within IR qualification standards
- RDS(on) shift due to fatigue of the board attach solder in both cases.
- Heatsink on top of can has ‘damping’ effect on temperature ramp rate – less thermal gradient across device.
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IR’s proprietary DirectFET®; technology is covered by US Patent 6,624,522 and
other US and foreign pending patent applications.
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