Get it from Application Note AN-1035 at www.irf.com

Please note that it is critical that the pad outlines on the board are checked as boards delivered from PCB vendor may differ from original gerber design files

1. Ensure that the temperature profile seen by the DirectFET meets at the least the minimum profile requirements as specified by the solder paste vendor.

2. Temperature profile of the DirectFET must be measured underneath / at the DirectFET with a thermocouple ‘buried’ in the board.

Solder Paste Volume is critical to solder joint quality and production yields.

Ensure the ratio of solder paste volume to PCB pad area is correct.

Get it from Application Note AN-1035 at www.irf.com

Solder paste volume is critical to achieving good solder joint quality and high production yields.

Stencil Designs

In order for all DirectFET MOSFET solder connections to be made, the Pick & Place machine should be set to give a placement force of 150 – 250g and/or an overtravel into the printed solder paste of 0.05 – 0.10mm (0.002 – 0.004”)

• Forces standoff beneath gate and source pads which improves thermal fatigue resistance
• Reduces incidence of solder balling