Pad layout – Extended Drain Rail
- Primarily designed to provide more fillet area to allow for pin-testing
- Also helps to reduce tilt and device sensitivity to volume of solder on the drain pad
- Reduces the centring ability of the device very slightly but not to a problematic level
- In the old and extended versions the drain rails are split into two for both the copper on the board and the solder that is printed
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DirectFET Package Outlines
The new method of outline identification breaks all of the low voltage devices into up to 3 die sizes* within each can.
* Each die size has it’s own specific pad layout. Refer to datasheets for exact dimensions.
Refer to the following URL for further details:
/technical-info/appnotes/an-1035.pdf
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