Die Application Notes
AN-1060: Bare Die: Handling and Storage PDF
AN-1061: Bare Die: Die Attach and Wire Bonding PDF
Shipping - The Pro’s and Con’s of using the various forms of Die transportation and the storage and handling implications.
Excerpt from Power Electronics 101: Basic Semiconductor Theory
Excerpt from Power Electronics 101: Mounting Techniques
This data is provided as an illustration as to the consideration to be taken when mounting IR Die; however, the use of IR Die to be assembled into similar packages directly competing against an IR package solution, will not be supported without express written permission from International Rectifier
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