AN-1061: Bare Die: Die Attach and Wire Bonding PDF

Shipping - The Pro’s and Con’s of using the various forms of Die transportation and the storage and handling implications.

Excerpt from Application Training Guide: Basic Semiconductor Theory

Excerpt from Application Training Guide: Mounting Techniques

This data is provided as an illustration as to the consideration to be taken when mounting IR Die; however, the use of IR Die to be assembled into similar packages directly competing against an IR package solution, will not be supported without express written permission from International Rectifier