Our packaging site provides you with updated package data for all of our products. So whether you are reviewing a previously scanned datasheet or you simply need access to our library of packaging information; we recommend that you please use the links below.
AN-1031: Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages AN-1016: Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration AN-1012: Mounting Considerations for International Rectifier's Power Semiconductor Packages AN-1000: Mounting Guidelines for the Super-220™ AN-997: Mounting Guidelines for the Super-247™ TP-APEC 2002: Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors Part Marking: for Discrete Products
