INTERNATIONAL RECTIFIER - THE POWER MANAGEMENT LEADER

Package Information

Our packaging site provides you with updated package data for all of our products. So whether you are reviewing a previously scanned datasheet or you simply need access to our library of packaging information; we recommend that you please use the links below.
Power MOSFETs
IGBTs
HiRel Devices
Control Integrated Circuits
Intelligent Power Switch
Intelligent Power Modules
MERs

Application Notes
    AN-1170.pdf: Audio Power Quad Flat Pack No-Leads (PQFN) Board Mounting Application Note
    AN-1154.pdf: Discrete Power Quad Flat No-Lead (PQFN) and Power SO-8 Inspection Application Note
    AN-1136.pdf: Discrete Power Quad Flat Pack No-Leads (PQFN) Board Mounting Application Note
    AN-1133.pdf: SupIRBuck® MCM Power Quad Flat No-lead (PQFN) Inspection Application Note
    AN-1132.pdf: SupIRBuck® MCM Power Quad Flat No-lead (PQFN) Board Mount Application Note
    AN-1091.pdf: Recommended PCB Via Design for International Rectifier's BGA and LGA Packages
    AN-1080.pdf: DirectFET® Technology Inspection Application Note
    AN-1050.pdf: DirectFET® Materials and Practices Application Note
    AN-1035.pdf: DirectFET® Technology: Board Mounting Guidlines.
    AN-1031: Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages
    AN-1029.pdf: Optimizing a PCB Layout for an iPOWIR™ Technology Design
    AN-1028.pdf: Recommended Design, Integration and Rework Guidelines for International Rectifier's BGA and LGA Packages
    AN-1012: Mounting Considerations for International Rectifier's Power Semiconductor Packages
    AN-1000: Mounting Guidelines for the Super-220™
    AN-997: Mounting Guidelines for the Super-247™
    AN-994: Maximizing the Effectiveness of Your SMD Assemblies
    TP-APEC 2002: Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors
    Part Marking: for Discrete Products

 
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