Our packaging site provides you with updated package data for all of our products. So whether you are reviewing a previously scanned datasheet or you simply need access to our library of packaging information; we recommend that you please use the links below.
AN-1137.pdf: Power QFN® Technology Inspection Application Note AN-1136.pdf: Discrete Power Quad Flat Pack No-Leads (PQFN) Board Mounting Application Note AN-1133.pdf: Power QFN® Technology Inspection Application Note AN-1132.pdf: Power Quad Flat Pack No-Leads (PQFN) Board Mounting Application Note AN-1091.pdf: Recommended PCB Via Design for International Rectifier's BGA and LGA Packages AN-1080.pdf: DirectFET® Technology Inspection Application Note AN-1050.pdf: DirectFET® Materials and Practices Application Note AN-1035.pdf: DirectFET® Technology: Board Mounting Guidlines. AN-1031: Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages AN-1029.pdf: Optimizing a PCB Layout for an iPOWIR™ Technology Design AN-1028.pdf: Recommended Design, Integration and Rework Guidelines for International Rectifier's BGA and LGA Packages AN-1012: Mounting Considerations for International Rectifier's Power Semiconductor Packages AN-1000: Mounting Guidelines for the Super-220™ AN-997: Mounting Guidelines for the Super-247™ AN-994: Maximizing the Effectiveness of Your SMD Assemblies TP-APEC 2002: Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors Part Marking: for Discrete Products
