INTERNATIONAL RECTIFIER - THE POWER MANAGEMENT LEADER

Package Information

Our packaging site provides you with updated package data for all of our products. So whether you are reviewing a previously scanned datasheet or you simply need access to our library of packaging information; we recommend that you please use the links below.
Control Integrated Circuits
Power MOSFETs
IGBTs
FETKY™ devices
Intelligent Power Switch
MERs
HiRel Devices

Application Notes
    AN-1031: Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages
    AN-1016: Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration
    AN-1012: Mounting Considerations for International Rectifier's Power Semiconductor Packages
    AN-1000: Mounting Guidelines for the Super-220™
    AN-997: Mounting Guidelines for the Super-247™
    TP-APEC 2002: Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors
    Part Marking: for Discrete Products

 
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