MIL-PRF-38535 Screening and Quality Conformance Inspection Requirements

 

MIL-PRF-38535 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot.

MIL-PRF-38535 applies to microelectronic circuits such as integrated circuits.

 
MIL-STD-883 Screening Requirements
for class level S and level B
Test/Inspection Screening Level MIL-STD-883
Method
Level B Level S
Non-destructive bond pull - * 2023
Internal visual inspection 100% 100% 2010, condition B for class level B
2010, condition A for class level S
Temperature cycling 100% 100% 1010, condition C
Constant acceleration 100% 100% 2001, condition E
External visual inspection 100% 100%  
Particle impact noise detection
(PIND)
- 100% 2020, condition A for class level S
Serialization 1 100%  
Preburn-in electrical parameters 100% 100%  
Burn-in 100%
160 hours
100%
240 hours
1015
Interim electrical parameters - 100%  
High temperature reverse bias (HTRB) - 100%
72 hours
1015, condition A or C
Interim electrical parameters 100% 100%  
Percent defective allowable
(PDA) calculation
5% 5%  
Final electrical test
   Static @ 25°C
   Static @ min and max temps
   Switching test @ 25°C
100%
100%
100%
100%
100%
100%
 
Hermetic seal (fine and gross leak) 100% 100% 1014
Radiography - 100% 2012
External visual inspection 100% 100% 2009
* Process Monitor

 

 

MIL-STD-38535 Quality Conformance Inspection Requirements

MIL-PRF-38535 Group A Electrical Testing
Sub
Group
Parameters Quantity
(accept number)
1 Static tests at +25°C 116 (0)
2 Static tests at max. rated operating temp. 116 (0)
3 Static tests at min. rated operating temp. 116 (0)
4 Dynamic tests at +25°C 116 (0)
5 Dynamic tests at max. rated operating temp. 116 (0)
6 Dynamic tests at min. rated operating temp. 116 (0)
7 Functional tests at +25°C 116 (0)
8 Functional tests at max. & min. rated operating temp. 116 (0)
9 Switching tests at +25°C 116 (0)
10 Switching tests at max. rated operating temp. 116 (0)
11 Switching tests at min. rated operating temp. 116 (0)

 

 

MIL-PRF-38535 Group B Testing
Sub
Group
Parameters Minimum Sample Size
Quantity (accept number)
1 Resistance to solvents 3 (0)
2 Bond strength:
   a. Thermocompression
   b. Ultrasonic
   c. Flip-chip
   d. Beam lead
22 (0)
Based on the number of wires
Die shear test or stud pull 3 (0)
3 Solderability per MIL-PRF-38535

 

 

MIL-PRF-38535 Group C Testing
Sub
Group
Parameters Quantity
(accept number)
1 Steady-state life test
End-point electrical parameters
45 (0)

 

 

MIL-PRF-38535 Group D Testing
Sub
Group
Parameters Quantity
(accept number)
1 Physical dimensions 15 (0)
2 Lead Integrity
Seal (fine and gross)
15 (0)
3 Thermal Shock
Temperature Cycling
Moisture resistance
Seal (fine and gross)
Visual
End-point electricals
15 (0)
4 Shock
Vibration, variable frequency
Acceleration
Seal (fine and gross)
Visual
15 (0)
5 Salt atmosphere
Seal (fine and gross)
Visual
15 (0)
6 Internal water vapor (cavity packages) 3 (0) or 5 (1)
7 Adhesion of lead finish 15 (0)
8 Lid torque 5 (0)