MIL-PRF-38534 Screening and Quality Conformance Inspection Requirements

 

MIL-PRF-38534 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot.

MIL-PRF-38534 applies to multi-chip modules and systems such as power modules or DC-DC converters.

 
MIL-PRF-38534 Screening Requirements
Test/Inspection Screening Level MIL-STD-883
Method
Class H Class K
(Space Level)
Pre Seal Burn-in Optional Optional 1030
Nondestructive bond pull N/A 100% 2023
Internal visual 100% 100% 2017
Temperature Cycle 100% 100% 1010
Constant acceleration 100% 100% 2001
Mechanical shock 100% 100% 2002
Particle impact noise detection (PIND) N/A 100% 2020
Preburn-in electrical Optional 100%  
Burn-in 100% 100% 1015
Final electrical 100% 100%  
Seal 100% 100% 1014
Radiographic N/A 100% 2012
External visual 100% 100% 2009

The HiRel Products Group has also established standard, cost-effective screening programs known as the QIRL and OM803 program. Standard "off the shelf," Space, JANTXV or JANTX level product can be designated as QIRL. These products are fully compliant with all screening and Quality Conformance Inspection (QCI) requirements of MIL-PRF-19500 for Space, JANTXV or JANTX levels. They meet the same data sheet electrical and mechanical specifications, and are produced and tested on a JANS qualified line. The OM803 screening program was developed to offer low-cost screening to our customers while using methods and conditions defined in MIL-STD-750 and MIL-STD-883. The OM803 screening program is performed on all Omnirel standard products.

Note 1: Level 2 devices- burn-in time is 48 hours minimum, Level 3 devices - burn-in time is 160 hours minimum.
Note 2: PDAs apply to burn-in and post electricals only.
Note 3: When ordering "P" level devices, the letter "P" is not marked on the device.

 

 

MIL-PRF-38534 Quality Conformance Inspection

MIL-PRF-38534 Group A Electrical Testing
Sub
Group
Parameters Quantity
(accept number)
1 Static tests at +25°C 116 (0)
2 Static tests at max. rated operating temp. 76 (0)
3 Static tests at min. rated operating temp. 45 (0)
4 Dynamic test at +25°C 116 (0)
5 Dynamic tests at max. rated operating temp. 15 (0)
6 Dynamic tests at max. rated operating temp. 45 (0)
7 Functional tests at +25°C 116 (0)
8 Functional tests at max. and min. rated operating temp. 76 (0)
9 Switching tests at +25°C 116 (0)
10 Switching tests at max. rated operating temp. 76 (0)
11 Switching tests at min. rated operating temp. 45 (0)

 

 

MIL-PRF-38534 Group B Testing
Sub
Group
Parameters Quantity
(accept number)
Class
K H
1 Physical dimension 2 (0) X X
2 PIND 15 (0) X  
3 Resistance to solvents 3 (0) X X
4 Internal visual and mechanical 1 (0) X X
5 Bond strength:
   a. Thermocompression
   b. Ultrasonic or wedge
   c. Flip-chip
   d. Beam lead
2 (0) X X
6 Die shear strength 2 (0) X X
7 Solderability 1 (0) X X
8 Seal:
   a. Fine
   b. Gross
15 (0)   X
9 ESD:
   a. Electrical parameters
   b. ESDS
   c. Electrical parameters
3 (0) X X

 

 

MIL-PRF-38534 Group C Testing
Sub
Group
Parameters Quantity
(accept number)
Class
K H
1 External visual 5 (0) X X
PIND X X
Temperature cycling X  
Temperature cycling or
Thermal shock
  X
X
Mechanical shock and/or
Constant acceleration
X
X
X
X
Seal (fine and gross) X X
PIND X X
Visual examination X X
End-point electrical X X
2 Steady-state life test 22 (0) or 5 (0) X X
End-point electrical X X
3 Internal water vapor content 3 (0) or 5 (1) X X
4 Internal visual and mechanical 2 (0) X X
Wire bond strength X X
Element shear X X
 

 

 

MIL-PRF-38534 Group D Package Related Testing
Sub
Group
Parameters Quantity
(accept number)
1 Thermal shock 5 (0)
Stabilization bake 5 (0)
Lead integrity 1 (0)
Seal:
   a. Fine
   b. Gross
5 (0)
2 Moisture resistance 5 (0)
3 Salt atmosphere 5 (0)
4 Metal package isolation 3 (0)