MIL-PRF-19500 Screening and Quality Conformance Inspection Requirements

 

MIL-PRF-19500 covers screening requirements that all parts are submitted to as well as Quality Conformance inspection consisting of one or more of Group A, B, C, D and E for acceptance of the design of the process and of the production lot.

MIL-PRF-19500 applies to discrete components such as MOSFETs and Schottkys. QPL discrete components have been qualified per MIL-PRF-19500.

For more information on MIL-PRF-19500 screening and quality conformance inspection, consult the DoD document or contact factory.

 
MIL-PRF-19500 Screening Requirements
Test/Inspection MIL Screen Test/Inspection JANS MIL-STD-750 Method
1b Internal visual inspection (precap) 100% 2069
  Lot Accumulation    
3a Temperature cycling 20 cycles. No dwell time. Condition C, -55C to 150C 100% 1051 Condition C
4 (1) Constant acceleration (Omitted if approved alternate flow option applied) 100% 2006
5 (1) PIND - Particle impact noise detection (Omitted if approved alternate flow option applied) 100% 2052 Condition A
8 Case Marking and Serialization devices 100%  
15 Radiography 100% 2076
  Thermal impedance / Delta VSD 100% 3161
  IL Test 100% 3470
  SOA 100%  
  Initial Test / Gate Stress 100%  
9 Pre Burn-in electrical parameters, R&R 100%  
10 High temperature reverse bias (HTRB), 48 hours, MOSFET 100% 1042 Condition B
11 Interim electrical, R&R and delta parameters for PDA 100%  
12 High temperature reverse bias (HTRB), 240 hours, MOSFET 100% 1042 Condition A
13 Final electrical test, R&R and delta parameters for PDA 100%  
  Outlier identification 100% Initial + Final
  Hot and cold electrical test, R&R 100%  
  Outlier identification 100% Hot + Cold
14 Hermetic seal (fine and gross leak) 100% 1071
  Bubble Test in FC, no pressurization 100%  
17 Case isolation (Case Isolated Packages) 100% 1081
  Group A2 electrical test 100%  
16 External visual exam 100% 2071
  Packaging    
Note (1): An IR HiRel approved and certified alternate flow may be applied instead of 100% screen

 

 

MIL-PRF-19500 Quality Conformance Inspection

MIL-PRF-19500 Group A Inspection Electrical Verification
Sub group Parameters MIL-STD-750 Method JANS Quantity (accept number) JANTX, JANTXV, Quantity (accept number)
1 Visual and mechanical inspection 2071 15 (0) 45 (0)
2 DC (static) test at +25˚C +/- 3C   116 (0) 116 (0)
3 DC (static) tests at max. and min. temps at high (-0C, +10C) specified temperatures      
4 Dynamic tests at +25˚C +/- 3C      
5 "Safe operating area test (power trans.):
a. DC
b. Clamped inductive
c. Unclamped inductive
End point electrical measurements "
  45 (0) 45 (0)
6 "Surge current (diodes and recitifiers)
End point electrical measurements "
    22 (0)
7 Selected static and dynamic tests      

 

 

MIL-PRF-19500 Group B Inspection Mechanical Verification (JANS)
Sub group Parameters MIL-STD-750 Method JANS large lot Quantity (accept number) JANS, Small Lot Quantity (accept number)
1 Physical dimensions (case outline) 2066 22 (0) 8 (0)
2 Solderability 2026 15 leads (0) 6 leads (0)
  Resistance to solvents (ink mark only) 1022 15 (0) 6 (0)
  Salt Atmosphere (laser marked metal) 1041 3 (0) 3 (0)
3 Temperature cycling (100 cycles) 1051 22 (0) "6 (0)
Use 12 (0) for Alt flow"
  Surge (diodes only) 4066    
  Hermetic seal (fine and gross leak) 1071    
  "Constant acceleration 20kG or 10kG > 10W
(Applicable to alternative flow only) "
2006    
  "Particle impact noise detection, cond. A
(Applicable to alternate flow only)"
2052    
  Electrical measurements, A2      
  Decap internal visual (qualified design) precap 6 (0) 6 (0)
  Bond strength, condition D 2037 22 wires (0) or 11 (0) 12 wires (0) or 6 (0)
  SEM (when applicable)* 2077 6 (0)  
  Die shear 2017 11 (0) 6 (0)
4 "Intermittent operating life (6k cycles if wire is
8 mils or greater in diameter, otherwise 2k)"
1037 or 1042 22 (0) 12 (0)
  Hermetic seal (fine and gross leak) 1071    
  "Electrical measurements, A2
Thermal impedance (max. 15% shift) "
     
5 Accelerated steady state HT GB, power MOSFET 1042 22 (0) 12 (0)
  Cond. B, 48 hours @150C, 100% bias      
  Electrical measurements, A2      
  Accelerated steady state HTRB, power MOSFET 1042    
  Cond. A, 240 hours @150C, 100% bias      
  Electrical measurements, A2      
  Accelerated Steady State for Schottky 1038    
  340 hrs @ max rated Tj / 1K hrs per wafer lot      
  Electrical measurements, A2      
  Bond strength 2037 20 wires (0) 20 wires (0)
6 Thermal resistance (Diodes) 3101, 4081 22 (0) 8 (0)
7 High temp life (340 hours non-operating) (Diodes) 1032 32 (0) 12 (0)
  Electrical measurements, A2      
*Note: Not applicable for Schottky's

 

 

MIL-PRF-19500 Group C Inspection Long-term Reliability Verification, Periodic, Each Package Type
Sub group Parameters MIL-STD-750 Method All Quality Levels All Quality Levels
Large Lot Quantity (accept number)
1 Physical dimensions (Performed in B1 for JANS) 2066 15 (0) 6 (0)
2 Thermal shock, 25 cycles, cond. B 1056 22 (0) 6 (0)
  Terminal strength 2036    
  Hermetic seal (fine and gross leak) 1071    
  Moisture resistance 1021    
  Electrical measurements, A2      
3 Shock, 1,500G, 0.5ms, 5 blows, X1, Y1 and Z1 2016 22 (0) "6 (0)
Use 12 (0) for Alt flow"
  Vibration, variable frequency 2056    
  Constant acceleration, 1 minute in each orientation at 20,000 G's minimum, except at 10,000 G's minimum for devices with power rating of 10 watts. 2006    
  "Particle impact noise detection, cond A
(Approved alternative flow only)"
2052    
  Electrical measurements, A2      
4 Salt atmosphere (corrosion) 1041 15 (0) 6 (0)
5 Thermal resistance (if not performed in B) 3101, 4081 15 (0) 6 (0)
6 Steady state operation life (1,000 hours min.) or 1026 22 (0) 12 (0)
  intermittent operating life (6k cycles min.) 1037 or 1042    
  Electrical measurements, A2      
7 Internal water vapor 1018 5 (0) 5 (0)

 

 

MIL-PRF-19500 Group D Inspection Radiation Hardness Assurance Program
Sub group Parameters MIL-STD-750 Method JANTXV
Inspection Lot Quantity (accept number)
JANS Wafer
Inspection Lot Quantity (accept number)
2 "Steady-state total dose irradiation
Qualification and conformance inspection
End-point electrical parameters"
1019   "4(0)
2(0)
1(0)"
1. For device types ≥ 4,000 die per wafer
2. For device types > 500 and < 4,000 die per wafer
3. For device types ≤ 500 die per wafer

 

 

MIL-PRF-19500 Group E Inspection Product Qualification
Sub group Parameters MIL-STD-750 Method All Quality Levels
Large Lot Quantity (accept number)
1 Thermal shock (100 cycles) or 1056 45 (0)
  Temp. cycling (500 cycles min.) @ max. storage 1051  
  Hermetic seal (fine and gross leak) 1071  
  Electrical Measurements, A2    
2 Steady state operation life, HTGB 1042 45 (0)
  Electrical measurements, A2    
  Steady state operation life, HTRB 1038, 1042 45 (0)
  Electrical measurements, A2    
4 Thermal resistance (characterization) 3101, 4081 22 (0)
5 Barometric pressure 1001 3 (0)
  (devices with rated voltage > 200V    
6 ESD 1020 11 devices
7 Resistance to Soldering Heat 2031, H.6  
  Visual inspection    
  Hermetic seal (fine and gross leak) 1071  
  Electrical measurements, A2    
8 Single Event Effects (SEE) for ion specie and ion energy. Curve as a function of LET for fixed VGS and VDS bias conditions; 1080