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Automotive System Design Capabilities
for Application-Specific Power Modules and Sub-Systems
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International Rectifier develops and
manufactures application-specific power
modules and sub-systems focused on providing
customers with desired degrees of integration
and functionality. We deliver flexible
architectures to meet customers'
environmental, size, manufacturability and cost
objectives. Our experience with system level
design helps us make optimal tradeoffs
between power electronics, thermal
management, EMI and control strategies. We
are one of the few fully integrated automotive
suppliers that offer a total solution from power
semiconductors to control software.
Our high power density solutions are ideal for
high power applications such as EPS, HEPS,
alternators, Integrated Starter Alternators,
variable speed turbo/super chargers, fan
control and valve-train control.
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FEATURES AT A GLANCE
 | 40v MOSFET with embedded protection and charge pump in a single package |
| As low as 6mOhm RDS(on) in the TO-220 footprint |
| Integrated low EMI charge pump allows direct logic input |
| Benchmark industry ratings:
- Highest density packaging with IPS in SO-8
- Highest load current rating with current up to 75A
- Active clamp for inductive loads
- Open-load detection (HSS)
- Up to 20kHz frequency for Low Side Switches (LSS)
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PROTECTION FEATURES
| Over-current protection:
- Shutdown
- Current limiting
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| Over-temperature protection: |
| ESD protection |
THE IR ADVANTAGE
| Most rugged, efficient and compact switches fir the harshest environments |
| Provides charge pump and full switch protection with no additional circuitry |
| Up to 30% smaller PCB area than a discrete charge pump circuit |
| More than 1000 times longer life than electro-mechanical relays due to self protection and absence of wear and tear |
| Up to 20% lower on-resistance than relays reduces heat dissipation and heat sinks |
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ELECTRICAL DESIGN
IR approaches electrical design from a system
prospective to make optimal trade-offs between
technologies based on the specific application
needs. IR has developed a solid experience in a
wide range of power electronics topologies and
techniques, in particular 3-phase inverter for
motor drive applications and DC-DC converters.
Innovative design techniques such as integrated
inverter and driver circuitry and integrated current
sampling techniques simplify designs.
Building on our intimate knowledge of power
switches, we have developed proprietary device,
thermal and system models to calculate and
simulate power losses accurately and reliably as
well as predict device junction temperature.
System models take into account all relevant
operating parameters; from modulation strategy to
gate drive resistors. System models are available for
a variety of topologies, including resonant and
quasi-resonant. The application of these proprietary
models results in minimum die size for a given
reliability requirement. With silicon design in house,
we can obtain the exact die size requirements in a
short time.
Optimum die sizes combined with a clear
understanding of the power dissipation of the
circuits are key in designing compact and reliable
packaging.
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FEATURES AT A GLANCE
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PACKAGING DESIGN
IR offers state-of-the-art thermo-mechanical
design processes and tools to deliver compact,
highly reliable customized subsystems. We have
leading expertise in process and substrate
technologies to provide the best thermal
management solutions along with the mechanical
interface suitable for high volume automated
manufacture. In-house mechanical design allows
better integration of electrical, physical and
thermal requirements. Thermal performance is
simulated with finite element analysis (FEA)
software and proprietary software modules.
MECHANICAL DESIGN FOR EASY INTEGRATION INTO FINAL PRODUCT
We have design expertise in a variety of substrate
or base material systems such as thick film, isolated
metal substrate (IMS), direct bonded copper (DBC),
active metal braze (AMB) and die on substrate-less
housing (IR proprietary) designs. We have in-house
thick film capability, and our proprietary substrateless
design eliminates a seperate part. Thermal
stacks are optimized for cost and performance for
each specific application:
- Thick film: simple and cost-effective tool to implement more comlpex functions
- Isolated Metal Substrate: rugged and inexpensive, good for applications requiring high and low power on the same substrate
- Direct Bonded Copper (AlN or Si3N4, or Al203): good to excellent thermal properties and
temperature coefficient matching to silicon
- Substrate-less; proprietery solution for compact designs
Finite Element Analysis (FEA)
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FEATURES AT A GLANCE
We use a variety of techniques to enhance the performance and realiability of the package such as:
- Simulation of wirebond and die attach fatigue
- Calculation, simulation and validation of transient temperature distribution
- Thermal design of fluid dynamic systems
- High temperature die attach
- High current silicon connectors
- Leadframe technology to reduce inductance and interconnections
- Laser trimming
- Flip chip reflow soldering
Solid state relay fan controller
ISA half-bridge module
EPS module
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CONTROL HARDWARE & SOFTWARE
With specific expertise in automotive embedded
motor control, IR can integrate the control
hardware and software development with the
power stage design. Our proprietary modulation
techniques deliver high-efficiency, low EMC, and
low output harmonics. Our system level approach
leads to the optimal trade-offs between hardware
and software and allows integration of analog
and digital hardware design, leveraging our
experience with numerous cost effective fixedpoint
processors, both microcontrollers and
Digital Signal Processors (DSPs). We also offer
ASIC definition, design and project management
capabilities. Our experience spans various motor
types and control techniques such as BLDC,
PMSM, AC induction and SR.
We are fully equipped for complete control
system algorithm development, using
M ATLAB/SIMULINK™, PSIM™ for control
system simulation. Our proprietary control
algorithms include:
- Trapezoidal control of BLDC motors
- Phase advance and conduction angle control algorithms for BLDC motors
- Sinusoidal field-oriented control of PMSM motors
- Software resolver to Digital Converter
- Shunt Current Reconstruction
- Sensored and sensorless field-oriented AC motor control
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We provide complete control PCB design using
Protel™ for schematic capture and PCB layout. EMI
design and test is an integral part of the design, as
well as reliability prediction, using Relex™.
FEATURES AT A GLANCE
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TESTING AND vALIDATION
We take the designs to full qualification to
ensure reliable performance. We have system
level testing capabilities to qualify the
functionality and reliability of the power system.
We can test and validate power system designs
up to 20kW. Designs are validated in application
with thermocouples and infra-red imaging.
EMI testing capabilities
Conducted emissions pre-screen facility in-house
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Power system test capabilities include:
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