Aerospace and Defense

 

IR offers standard and custom power management solutions for commercial aircraft and military applications in hermetic, custom or industry standard packages. IR’s commercial aviation heritage encompasses solutions for the Airbus 300, 320A and 380 and Boeing’s 737, 777 and 787 airliners. Our high-reliability technologies can be found in a wide range of aircraft and ground vehicles including the F16, the Eurofighter, the F35 Joint Strike Fighter, H60 helicopters and the Abrams M1A2 tank.

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Military Aerospace DC-DC Converters

Part
DLA Drawing
Base Part Status
IOUT Single (A)
Outputs
Package
Qual Level
Call Factory
+ 10.67
160
80
+ 7.5
Single
AFL
Standard
80W
83
Call Factory
+ 1.333
50
16
+ 15
Single
ATS
Standard
25W
75
5962-94628
Active
+/-1
40
16
+/-15
Dual
ATR
Standard
30W
80
5962-02562
Active
+ 4
80
30
+ 28
Single
AFL
Standard
112W
84
5962-95501
Active
+/-8
400
160
+/-5
Dual
AFL
Standard
80W
82

Military Aerospace EMI Filter

Part
Package
Applications
Compatibility
AME
AFL28XX
50
AME
AFL270XX, AFL120XX
400
AFV
AHV,ATW,AHF,ATR,ATO,AHE,AMF,AMR
80
AME
AFL50XX
100
AF
ARE28
50

HiRel Power MOSFETs

Part
Package
BVDSS
JEDEC Part Number
TO-204AA
100
14
9
75
2N6756
18-pin LCC
-100
-6.5
-4.1
25
2N6849U
TO-204AA
500
12
7.75
150
2N6770
TO-205AF
100
6
3.5
20
2N6788
TO-254AA
500
12
8
150
2N7228

HiRel Schottkys

Part
Package
Circuit
VR (V)
VF @ IF @ 25C
SMD-0.5
Single Device
60
30
0.92
SMD-1
Common Cathode
45
35
0.63(20A)
TO-257AA
Single Device
150
16
0.97
SMD-0.5
Single Device
45
30
0.75
SMD-0.5
Common Cathode
30
30
0.61

HiRel Rectifiers

Part
Family HRDU
Package
Circuit
VR (V)
TO-258AA
Common Cathode
200
50
107
1.49
TO-259AA
Common Cathode
600
45
100
2.00
TO-257AA
Common Cathode
200
16
132
1.15
SMD-0.5
Single Device
200
25
106
1.18
TO-258AA
Single Device
200
50
87
1.28

HiRel IGBT Discretes

Part
Package
Circuit
VCES (V)
PD @25C
TO-254AA
Discrete
600
2.25
35
27
150
0.83
TO-254AA
Discrete
600
1.7
28
15
75
1.67
TO-254AA
Discrete
600
2
35
30
150
0.83
TO-254AA
Discrete
600
2.1
35
20
125
1

HiRel IGBT Modules

Part
Package
Circuit
HiRel INT-A-Pak 2
Half Bridge
600
450
+/- 20
900
3400
12.0
1.8
HiRel INT-A-Pak 3
Full Bridge
600
150
+/- 20
1200
2100
9.0
2.3
HiRel INT-A-Pak 2
Half Bridge
1200
300
+/- 20
1000
2200
20.0
1.8

HiRel Voltage Regulators

Part
Package
Circuit
TO-257AA
Positive Fixed
15
1.5
17.5
30
MO-078AA
Positive Adjustable
7
6.0
13
ULDO
1.5
5.5
0.54
0.62
6
13
1.33
TO-257AA
Positive Adjustable
1.5
4.25
61.25
1.2
57
SMD-3
Positive Adjustable
1.5
4.25
61.25
1.2
57
MO-078AA
Dual Fixed
1.5
-30
30
-12
15

HiRel Gate Driver ICs

Part
Voffset
Circuit
Package
400
Active
HI & LO MOS Drivers
10
18-pin LCC
20
400
Active
3PH Bridge Driver
10
MO-038AB
20
600
Active
HI & LO MOS Drivers
10
MO-036AB
20
600
Active
HI & LO MOS Drivers
10
18-pin LCC
20
400
Active
HI & LO MOS Drivers
10
MO-036AB
20

International Rectifier’s hirel devices are recognized for their excellent reliability with unparalleled design heritage and are at the heart of systems powering mankind’s most mission critical applications. You will find us throughout the world and above it, in commercial and military aircraft and helicopters, missiles, smart munitions, weapon systems, radars, UAV and ground vehicles.

Military Aviation Flight Heritage

  • AH-64
  • AIM9X
  • ATACMS
  • Boeing AGM130
  • Boeing J-DAM
  • Cobra Judy
  • DDG 1000 Destroyer
  • Eurocopter Tiger
  • Eurofighter
  • Euro-Fighter Typhoon
  • F-16
  • F-18
  • F-22 Raptor
  • H60 Helicopter
  • Harpoon
  • Joint Strike Fighter – F35
  • Minuteman III Missile Guidance Set
  • M1A2 Tank
  • PAC-3 Missile
  • Panavia Tornado ADV
  • SAAB Gripen
  • Trident Missile
  • WAH64 Helicopter

Commercial Aviation Flight Heritage

  • Airbus 300
  • Airbus 320
  • Airbus 380
  • Boeing 737
  • Boeing 777
  • Boeing 787 Dreamliner
  • Embraer Legacy 450/500

 

 

 MANUFACTURING, PROCESS AND TESTING CAPABILITIES
 

Certifications:

  • MIL-PRF-38534, certified to class H and K
  • ISO 9000
  • MIL-PRF- 19500 JANS level

Equipment:

  • Automatic component pick and place
  • Automatic Au and Al wire bond
  • Surface mount circuit board assembly

Processes:

  • Substrate attach
  • Die attach
  • Thick film printing and cofiring
  • Wire bonding Al and Au
  • Package sealing
    • Welding
    • Encapsulant
  • Test and burn-in

Full In-House Reliability Screening: 

  • Element evaluations
  • Air or liquid burn-in
  • Temperature cycling
  • Steady-state life
  • Constant acceleration
  • Mechanical shock
  • Thermal shock

In-House Capabilities:

  • TESEC® test system (up to 3,000 volts, 600 amps)
  • Eagle® mixed signal test systems
  • Dynamic burn-in chambers
  • Custom testing (using LabVIEW™ software)
  • ESS testing (when required)
  • Radiation susceptibility analysis
  • LEMSYS™ 1500V 2000A IGBT Dynamic Tester
  • PIND
  • Hermeticity
    • Fine
    • Gross