Aerospace and Defense

 

IR offers standard and custom power management solutions for commercial aircraft and military applications in hermetic, custom or industry standard packages. IR’s commercial aviation heritage encompasses solutions for the Airbus 300, 320A and 380 and Boeing’s 737, 777 and 787 airliners. Our high-reliability technologies can be found in a wide range of aircraft and ground vehicles including the F16, the Eurofighter, the F35 Joint Strike Fighter, H60 helicopters and the Abrams M1A2 tank.

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Military Aerospace DC-DC Converters

Part
DLA Drawing
IOUT Single (A)
Outputs
Package
Qual Level
Total Output Power (W)
Active
+ 9
400
160
+ 12
Single
AHP
Standard
66W - 120W
85
5962-89683
Active
+ 3
40
17
+ 5
Single
AHE
Standard
15W - 20W
82
5962-95565
Active
+ 4
400
160
+ 28
Single
AFL
Standard
66W - 120W
85
5962-92040
Active
+/-0.625
40
17
+/-12
Dual
AHE
Standard
15W - 20W
82
Active
+ 20
400
160
+ 3.3
Single
AHP
Standard
66W - 120W
76

Military Aerospace EMI Filter

Part
Package
Applications
Compatibility
AFM
All converters except AFL
40
AME
AFL50XX
100
AFC
ATW,AHF,AHV,ATR,ATO,AHE,AMF,AMR
40
AME
AFL28XX
50
AME
AFL270XX, AFL120XX
400

HiRel Power MOSFETs

Part
Package
BVDSS
TO-257AA
500
10
6.6
125
SMD-1
55
55
55
100
TO-257AA
400
8.7
5.5
100
TO-257AA
-200
-9.4
-6
100
TO-254AA
60
35
28
125

HiRel Schottkys

Part
Package
Circuit
VR (V)
VF @ IF @ 25C
SMD-0.5
Common Cathode
30
30
0.61
SMD-1
Single Device
45
60
0.68
TO-254AA
Common Anode
100
35
1.30
SMD-1
Common Cathode
30
80
0.56
SMD-0.5
Common Cathode
45
8.5
0.67(4A)

HiRel Rectifiers

Part
Family HRDU
Package
Circuit
VR (V)
TO-259AA
Common Cathode
200
50
100
1.54
SMD-1
Common Cathode
1200
15
100
3.30
TO-258AA
Common Cathode
600
45
100
2.00
SMD-1
Single Device
1200
11
100
3.10
SMD-0.5
Common Cathode
200
20
85
1.30

HiRel IGBT Discretes

Part
Package
Circuit
VCES (V)
PD @25C
TO-254AA
Discrete
600
2.25
35
27
150
0.83
TO-254AA
Discrete
600
1.7
28
15
75
1.67
TO-254AA
Discrete
600
2.1
35
20
125
1
TO-254AA
Discrete
600
2
35
30
150
0.83

HiRel IGBT Modules

Part
Package
Circuit
HiRel INT-A-Pak 3
Full Bridge
600
150
+/- 20
1200
2100
9.0
2.3
HiRel INT-A-Pak 2
Half Bridge
1200
300
+/- 20
1000
2200
20.0
1.8
HiRel INT-A-Pak 2
Half Bridge
600
450
+/- 20
900
3400
12.0
1.8

HiRel Voltage Regulators

Part
Package
Circuit
TO-257AA
Positive Fixed
5
3
7.5
25
SMD-3
Positive Fixed
12
1.5
14.5
30
TO-204AA
Positive Adjustable
1.5
4.25
61.25
1.2
57
SMD-3
Positive Adjustable
1.5
4.25
61.25
1.2
57
MO-078AA
Dual Fixed
1.5
-30
30
-12
15

HiRel Gate Driver ICs

Part
Package
Circuit
Special HR
18-pin LCC
HI & LO MOS Drivers
10
Delay Matching
MO-038AB
3PH Bridge Driver
10
Current Sensing and UVLD
MO-036AB
HI & LO MOS Drivers
10
Delay Matching
MO-036AB
HI & LO MOS Drivers
10
Delay Matching
MO-036AA
High Side Driver
12
Current Limiting

International Rectifier’s hirel devices are recognized for their excellent reliability with unparalleled design heritage and are at the heart of systems powering mankind’s most mission critical applications. You will find us throughout the world and above it, in commercial and military aircraft and helicopters, missiles, smart munitions, weapon systems, radars, UAV and ground vehicles.

Military Aviation Flight Heritage

  • AH-64
  • AIM9X
  • ATACMS
  • Boeing AGM130
  • Boeing J-DAM
  • Cobra Judy
  • DDG 1000 Destroyer
  • Eurocopter Tiger
  • Eurofighter
  • Euro-Fighter Typhoon
  • F-16
  • F-18
  • F-22 Raptor
  • H60 Helicopter
  • Harpoon
  • Joint Strike Fighter – F35
  • Minuteman III Missile Guidance Set
  • M1A2 Tank
  • PAC-3 Missile
  • Panavia Tornado ADV
  • SAAB Gripen
  • Trident Missile
  • WAH64 Helicopter

Commercial Aviation Flight Heritage

  • Airbus 300
  • Airbus 320
  • Airbus 380
  • Boeing 737
  • Boeing 777
  • Boeing 787 Dreamliner
  • Embraer Legacy 450/500

 

 

 MANUFACTURING, PROCESS AND TESTING CAPABILITIES
 

Certifications:

  • MIL-PRF-38534, certified to class H and K
  • ISO 9000
  • MIL-PRF- 19500 JANS level

Equipment:

  • Automatic component pick and place
  • Automatic Au and Al wire bond
  • Surface mount circuit board assembly

Processes:

  • Substrate attach
  • Die attach
  • Thick film printing and cofiring
  • Wire bonding Al and Au
  • Package sealing
    • Welding
    • Encapsulant
  • Test and burn-in

Full In-House Reliability Screening: 

  • Element evaluations
  • Air or liquid burn-in
  • Temperature cycling
  • Steady-state life
  • Constant acceleration
  • Mechanical shock
  • Thermal shock

In-House Capabilities:

  • TESEC® test system (up to 3,000 volts, 600 amps)
  • Eagle® mixed signal test systems
  • Dynamic burn-in chambers
  • Custom testing (using LabVIEW™ software)
  • ESS testing (when required)
  • Radiation susceptibility analysis
  • LEMSYS™ 1500V 2000A IGBT Dynamic Tester
  • PIND
  • Hermeticity
    • Fine
    • Gross