Aerospace and Defense

 

IR offers standard and custom power management solutions for commercial aircraft and military applications in hermetic, custom or industry standard packages. IR’s commercial aviation heritage encompasses solutions for the Airbus 300, 320A and 380 and Boeing’s 737, 777 and 787 airliners. Our high-reliability technologies can be found in a wide range of aircraft and ground vehicles including the F16, the Eurofighter, the F35 Joint Strike Fighter, H60 helicopters and the Abrams M1A2 tank.

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Military Aerospace DC-DC Converters

Part
DLA Drawing
IOUT Dual (A)
Outputs
Package
Qual Level
5962-94631
Active
+ 0.417
40
16
+ 12
Single
ASA
Standard
5W
74
5962-92109
Active
+/-1.25
40
18
+/-12
Dual
ATW
Standard
30W
83
Active
+/-0.6
50
15
+/-15
Dual
ASAP
Standard
6W
71
5962-94627
Active
+/-1.25
40
16
+/-12
Dual
ATR
Standard
30W
80
5962-94649
Active
+/-0.167
40
16
+/-15
Dual
ASA
Standard
5W
72

Military Aerospace EMI Filter

Part
Package
Applications
Compatibility
AME
AFL50XX
100
AFC
ATW,AHF,AHV,ATR,ATO,AHE,AMF,AMR
40
AFV
AHV,ATW,AHF,ATR,ATO,AHE,AMF,AMR
80
AFM
All converters except AFL
40
AME
AFL270XX, AFL120XX
400

HiRel Power MOSFETs

Part
Package
BVDSS
TO-254AA
400
23
14
250
TO-254AA
60
35
35
250
TO-205AF
20
12
10.6
20
TO-257AA
100
16
16
100
TO-258AA
200
45
29
300

HiRel Schottkys

Part
Package
Circuit
VR (V)
VF @ IF @ 25C
SMD-1
Common Cathode
150
80
0.96
TO-254AA
Single Device
100
30
1.1
TO-259AA
Common Cathode
45
45
0.71(25A)
TO-257AA
Single Device
45
10
0.73
SMD-1
Common Cathode
150
35
1.13(15A)

HiRel Rectifiers

Part
Family HRDU
Package
Circuit
VR (V)
TO-257AA
Common Cathode
200
16
120
1.17
TO-258AA
Single Device
200
50
87
1.28
TO-254AA
Single Device
600
22
100
1.75
TO-258AA
Common Cathode
200
50
107
1.49
SMD-0.5
Single Device
200
25
106
1.18

HiRel IGBT Discretes

Part
Package
Circuit
VCES (V)
PD @25C
TO-254AA
Discrete
600
2
35
30
150
0.83
TO-254AA
Discrete
600
1.7
28
15
75
1.67
TO-254AA
Discrete
600
2.25
35
27
150
0.83
TO-254AA
Discrete
600
2.1
35
20
125
1

HiRel IGBT Modules

Part
Package
Circuit
HiRel INT-A-Pak 2
Half Bridge
600
450
+/- 20
900
3400
12.0
1.8
HiRel INT-A-Pak 3
Full Bridge
600
150
+/- 20
1200
2100
9.0
2.3
HiRel INT-A-Pak 2
Half Bridge
1200
300
+/- 20
1000
2200
20.0
1.8

HiRel Voltage Regulators

Part
Package
Circuit
SMD-3
Positive Fixed
12
1.5
14.5
30
TO-257AA
Positive Fixed
5
3
7.5
25
SMD-3
Positive Adjustable
1.5
4.25
41.25
1.2
37
TO-257AA
Positive Adjustable
1.5
4.25
61.25
1.2
57
SMD-3
Positive Adjustable
1.5
4.25
61.25
1.2
57

HiRel Gate Driver ICs

Part
Package
Circuit
Special HR
MO-038AB
3PH Bridge Driver
10
Current Sensing and UVLD
MO-036AB
HI & LO MOS Drivers
10
Delay Matching
18-pin LCC
HI & LO MOS Drivers
10
Delay Matching
18-pin LCC
HI & LO MOS Drivers
10
Delay Matching
MO-036AB
HI & LO MOS Drivers
10
Delay Matching

International Rectifier’s hirel devices are recognized for their excellent reliability with unparalleled design heritage and are at the heart of systems powering mankind’s most mission critical applications. You will find us throughout the world and above it, in commercial and military aircraft and helicopters, missiles, smart munitions, weapon systems, radars, UAV and ground vehicles.

Military Aviation Flight Heritage

  • AH-64
  • AIM9X
  • ATACMS
  • Boeing AGM130
  • Boeing J-DAM
  • Cobra Judy
  • DDG 1000 Destroyer
  • Eurocopter Tiger
  • Eurofighter
  • Euro-Fighter Typhoon
  • F-16
  • F-18
  • F-22 Raptor
  • H60 Helicopter
  • Harpoon
  • Joint Strike Fighter – F35
  • Minuteman III Missile Guidance Set
  • M1A2 Tank
  • PAC-3 Missile
  • Panavia Tornado ADV
  • SAAB Gripen
  • Trident Missile
  • WAH64 Helicopter

Commercial Aviation Flight Heritage

  • Airbus 300
  • Airbus 320
  • Airbus 380
  • Boeing 737
  • Boeing 777
  • Boeing 787 Dreamliner
  • Embraer Legacy 450/500

 

 

 MANUFACTURING, PROCESS AND TESTING CAPABILITIES
 

Certifications:

  • MIL-PRF-38534, certified to class H and K
  • ISO 9000
  • MIL-PRF- 19500 JANS level

Equipment:

  • Automatic component pick and place
  • Automatic Au and Al wire bond
  • Surface mount circuit board assembly

Processes:

  • Substrate attach
  • Die attach
  • Thick film printing and cofiring
  • Wire bonding Al and Au
  • Package sealing
    • Welding
    • Encapsulant
  • Test and burn-in

Full In-House Reliability Screening: 

  • Element evaluations
  • Air or liquid burn-in
  • Temperature cycling
  • Steady-state life
  • Constant acceleration
  • Mechanical shock
  • Thermal shock

In-House Capabilities:

  • TESEC® test system (up to 3,000 volts, 600 amps)
  • Eagle® mixed signal test systems
  • Dynamic burn-in chambers
  • Custom testing (using LabVIEW™ software)
  • ESS testing (when required)
  • Radiation susceptibility analysis
  • LEMSYS™ 1500V 2000A IGBT Dynamic Tester
  • PIND
  • Hermeticity
    • Fine
    • Gross