IR HiRel Space Systems

 

IR HiRel has a long history serving the space flight industry with high-reliability, radiation hardened power management solutions. We understand the engineering complexities of designing for failure-free performance in the extreme thermal, mechanical and radiation environments of space. Since 1985, customers have relied on IR HiRel solutions for mission-critical power management in thousands of space, aerospace and national security programs, ranging from space exploration vehicles to launchers and satellites. Many of these programs are still in flight today.

IR HiRel was the first to provide rad hard MOSFETs for space in 1985 and is now a leading provider of radiation hardened power management solutions. We offer a unique portfolio of standard and custom products specifically designed for the tough applications where commercial electronics fail. Our power management solutions have been part of most major defense, civil, and commercial space missions around the world.

IR HiRel’s expansive power management portfolio includes:

Faster Development, Reduced Risk with IR HiRel

Not finding a standard product that suits your needs? IR HiRel’s expert design team regularly works with customers to semi-customize or develop fully custom products to address complex, specific requirements and applications. Created in partnership with customers, IR HiRel’s custom designed products are engineered for optimal integration with host equipment, reducing development effort and risk. Contact us with your specific challenge.

IR HiRel combines its world-class heritage with deep technical expertise and product innovation to deliver benchmark power management solutions for customers. Our products have been used since 1985 in thousands of space programs, both government and commercial. IR HiRel’s radiation hardened devices are recognized globally for their excellent reliability, longevity and unparalleled design heritage. You’ll find them successfully used in most mission-critical applications throughout the world and above it, such as launch vehicles, Low Earth Orbit (LEO), Medium Earth Orbit (MEO) and GEO satellites, space exploration vehicles and other classified programs.

Over 30 Years of Heritage in Thousands of Programs

Below is a select sampling of programs supported by IR HiRel. Contact us to explore how we can help you achieve mission success.

 

Space Programs

Satellite Busses

Space Exploration

Service Providers

  • Classified programs
  • GALILEO
  • GLONASS
  • GOES
  • GPS II and III
  • Iridium NEXT
  • METEOSAT
  • METOP
  • NPOESS
  • AEHF Lockheed Martin
  • AIRBUS Alphabus
  • BOEING 702
  • LOCKHEED LM2100
  • Northrop Grumman
    (Orbital ATK GeoStar)
  • SSL 1300
  • THALES SpaceBus
  • Deep Space Probe
  • International Space Station
  • ExoMars
  • Hubble Telescope
  • James Webb Space Telescope
  • Lunar Reconnaissance Orbiter
  • NASA Mars Rover
  • Space Launch System (SLS)
  • Inmarsat
  • Intelsat
  • OHB SE
  • Telestar
  • Viasat

 

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General Purpose Isolated DC-DCs

Part
DLA Drawing
Base Part Status
IOUT Dual (A)
Outputs
Package
Qual Level
Call Factory
+/-2.3
28
40
18
+/-12
Dual
LSO
Radiation Hardened
82
100
30W
81
5962-04243
Call Factory
+/-0.417
28
40
18
+/-12
Dual
S
Radiation Hardened
80
100
10W
78
5962-04242
Call Factory
+/-1
28
40
18
+/-5
Dual
S
Radiation Hardened
80
100
10W
80
5962-04247
Call Factory
+ 1
28
40
16
+ 5
Single
AMA
Rad-Tolerant
60
30
5W

DC-DC Converters for Digital Loads

Part
DLA Drawing
Base Part Status
IOUT Dual (A)
IOUT Single (A)
Outputs
Package
Qual Level
Call Factory
+/-2.3
28
40
18
+/-12
Dual
LSO
Radiation Hardened
82
100
30W
81
5962-04247
Call Factory
+ 1
28
40
16
+ 5
Single
AMA
Rad-Tolerant
60
30
5W
Call Factory
+/-1.6
28
40
18
+/-15
Dual
LSO
Radiation Hardened
82
100
30W
81
Call Factory
+ 6.06
28
50
16
+ 3.3
Single
M3L
Rad-Tolerant
37
25
25W
75
Call Factory
+ 9.1
28
50
18
+ 3.3
Single
M3H
Rad-Tolerant
37
25
40W
73

DC-DC for Space RF Applications

Part
DLA Drawing
Base Part Status
IOUT Dual (A)
Qual Level
5962-04243
Call Factory
+/-0.417
28
40
18
+/-12
Dual
S
Radiation Hardened
80
100
10W
78
5962-04242
Call Factory
+/-1
28
40
18
+/-5
Dual
S
Radiation Hardened
80
100
10W
80
5962-05242
Call Factory
+/-1.6
28
40
18
+/-15
Dual
LS
Radiation Hardened
82
100
30W
83
5962-04244
Call Factory
+/-0.333
28
40
18
+/-15
Dual
S
Radiation Hardened
80
100
10W
78

Space EMI Filters

Part
Package
Applications
Compatibility
SF
S28xx
100
AF
ARE100
150
AFH
AMF
80
ARF
ART,ARH
80

Rad-Hard Power MOSFETs

Part
Package
BVDSS
JEDEC Part Number
TO-254AA Low Ohmic
-60
-45
-45
208
2N7524T1
SMD-0.5
-100
-12.5
-8
75
2N7545U3
TO-254AA Low Ohmic
250
45
28.5
208
2N7586T1
TO-257AA Low Ohmic
150
19
12
75
SMD-2
60
56
56
250

Rad-Hard Synchronous Rectifiers

Part
BVDSS
Base Part Status
Circuit
ESD Class
ESD Voltage Range
Package
60
0.0061
Active
Synchronous Rectifier
Class 3B
8,000 to 15,999
0.90
75
75
SMD-2
N
250
6.60
60
0.0056
Obsolete
Synchronous Rectifier
Class 3B
8,000 to 15,999
0.90
75
75
SMD-2
N
250
7.03
30
0.0035
Active
Synchronous Rectifier
Class 3B
8,000 to 15,999
1.05
75
75
SMD-2
N
250
7.03
30
0.0061
Call Factory
Synchronous Rectifier
Class 3B
8,000 to 15,999
1.05
75
75
SMD-2
N
250
6.50

Space Schottkys

Part
Package
Circuit
VR (V)
VF @ IF @ 25C
D2
Single Device
45
16
0.56
SMD-1
Common Cathode
45
35
0.63(20A)
TO-254AA
Single Device
100
30
1.1
SMD-0.5
Common Cathode
60
30
0.9
TO-254AA
Single Device
45
35
0.93

Rad-Hard Gate Drive ICs

Part
Package
Circuit
Special HR
18-pin LCC
HI & LO MOS Drivers
400
20
MO-036AB
HI & LO MOS Drivers
400
20
14-Lead FlatPak
HI & LO MOS Drivers
400
20
18-pin LCC
HI & LO MOS Drivers
10
Delay Matching and 100K Rad (Si)
MO-036AB
HI & LO MOS Drivers
10
Delay Matching and 100K Rad (Si)

Rad-Hard Solid State Relays

Part
Package
Circuit
Response tr / tf
8-Pin SM
Form A
2
100
10
Controlled
100
8-Pin SM
Form A
2
100
10
Controlled
100
5-Pin SM
Form A
1
60
20
Fast
100
8-Pin SM
Form A
2
100
10
Fast
100
64-Pin FlatPack
Form A
8
100
1.3
Intermediate
100
 MANUFACTURING, PROCESS AND TESTING CAPABILITIES
 

Certifications:

Equipment:

  • Automatic component pick and place
  • Automatic Au and Al wire bond
  • Surface mount circuit board assembly

Processes:

  • Substrate attach
  • Die attach
  • Thick film printing and cofiring
  • Wire bonding Al and Au
  • Package sealing - welding
    • encapsulant
  • Test and burn-in

Full In-House Reliability Screening:

  • Element evaluations
  • Air or liquid burn-in
  • Temperature cycling
  • Steady-state life
  • Constant acceleration
  • Mechanical shock
  • Thermal shock

In-House Capabilities:

  • TESEC® test system (up to 3,000 volts, 600 amps)
  • Eagle® mixed signal test systems
  • Dynamic burn-in chambers
  • Custom testing (using LabVIEW™ software)
  • ESS testing (when required)
  • Radiation susceptibility analysis
  • LEMSYS™ 1500V 2000A IGBT Dynamic Tester
  • PIND
  • Hermeticity
    • Fine
    • Gross